A thin film structure that folds automatically and directionally under thermal excitation

A thin-film structure and heat-activated technology, applied in the field of isotropic heat-deformable materials, can solve the problems of uncontrollable bending direction and low precision, and achieve the effect of realizing crease position and folding direction, realizing precise control and simplifying preparation

Active Publication Date: 2019-03-26
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims to solve the current technical problem that the bending direction of the automatic folding deformation material under thermal excitation is uncontrollable and the accuracy is low, and provides a film structure that automatically orientates and folds under thermal excitation

Method used

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  • A thin film structure that folds automatically and directionally under thermal excitation
  • A thin film structure that folds automatically and directionally under thermal excitation
  • A thin film structure that folds automatically and directionally under thermal excitation

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specific Embodiment approach 1

[0017] Specific Embodiment 1: In this embodiment, a film structure that is automatically orientated and folded under thermal excitation includes a base 1, a flexible adhesive 2, a thermally deformable film 3, and a number of slits 4; wherein the flexible adhesive 2 is arranged on the base along the crease 1, the thermally deformable film 3 covers the flexible adhesive 2; several slits 4 are perpendicular to the creases, and completely penetrate the thermally deformable film 3 and the flexible adhesive 2 in the depth direction.

specific Embodiment approach 2

[0018] Embodiment 2: This embodiment differs from Embodiment 1 in that the distance between two adjacent slits 4 is smaller than the width of the heat-deformable film 3 . Others are the same as in the first embodiment.

specific Embodiment approach 3

[0019] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the distance between two adjacent slits 4 is one-third of the width of the heat-deformable film 3 . Others are the same as in the first or second embodiment.

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Abstract

The invention discloses a film structure capable of being folded automatically and directionally under thermal excitation and relates to the field of isotropic thermal deformation materials. Accordingto the film structure, the technical problems that as for an existing deformation material capable of being folded automatically under thermal excitation, the bending direction is uncontrollable, andaccuracy is low are solved. The film structure capable of being folded automatically and directionally under thermal excitation comprises a substrate, a flexible adhesive, a thermal deformation filmand a plurality of slits, wherein the flexible adhesive is arranged on the substrate along a fold, the thermal deformation film covers the flexible adhesive, and the multiple slits are perpendicular to the fold and completely penetrate through the thermal deformation film and the flexible adhesive in the depth direction. By adopting the original method and utilizing a common isotropic thermal deformation material and by means of an existing automatic production process, accurate control over the fold position and the folding direction of the deformable film is achieved, and preparation of thedeformable film is simplified greatly.

Description

technical field [0001] The invention relates to the field of isotropic heat-deformable materials. Background technique [0002] The low-cost continuous preparation of origami-type honeycomb structures and thin-film metamaterials urgently requires a new type of deformable thin film that can use isotropic thermally deformable materials and existing automated production processes to achieve precise control of crease position and folding direction. [0003] In recent years, researchers have proposed a variety of smart materials that can automatically fold and deform under thermal excitation. The deformation often uses the material's shape memory effect, thermal expansion and contraction, or stress relaxation. Its basic principle is similar to that of a bimetal sheet, that is, when a layer of thermally deformable material is consolidated with a layer of relatively stable base material, thermal deformation, such as thermal shrinkage, will bend the material. The problem with this ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C65/48
Inventor 武睿
Owner HARBIN INST OF TECH
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