Dip-mode etching device and dip-mode etching method

Abstract

The invention provides a dip-mode etching device and a dip-mode etching method. The dip-mode etching device includes a bearing platform, a sensor, and an etching groove. The etching groove is providedwith a plurality of liquid inlets and a plurality of liquid outlets at the lower and upper ends respectively. Etching solution is constantly transferred via the liquid inlets, and excessive etching solution is constantly discharged via the liquid outlets, so that there is always etching solution in the etching groove, and the etching solution in the etching groove is always fresh. There is no need to store and discharge etching solution again for each substrate, and the etching efficiency is improved. As the liquid outlets are arranged at the upper end of the etching groove to constantly discharge excessive etching solution, the formation of product Mura due to quick opening of the shutter during liquid discharge of the existing etching device is avoided. In addition, the sensor for judging the end point of etching is set, and compared with observation through eyes, the end point of etching can be judged more accurately, and the best product parameter specification can be obtained.

Description

technical field [0001] The invention relates to the field of manufacturing processes of flat panel displays, in particular to an immersion etching device and an immersion etching method. Background technique [0002] In the field of display technology, flat panel display devices such as Liquid Crystal Display (LCD) and Active Matrix Organic Light-Emitting Diode (AMOLED) display have thin body, high image quality, Many advantages such as power saving and no radiation have been widely used, such as mobile phones, personal digital assistants (PDAs), digital cameras, computer screens or notebook screens, etc. [0003] Thin Film Transistor (Thin Film Transistor, TFT) array (Array) substrates are the main components of current LCD devices and AMOLED devices, and are directly related to the development direction of high-performance flat panel display devices. For example, the LCD manufacturing process generally includes: the front-end array process, the middle-end cell (Cell) proc...

AI Technical Summary

Problems solved by technology

[0008] Then adopt the existing immersion type etching equipment to etch the glass substrate and there will be the following problems: one is for each piece of glass substrate, it is necessary to perform the closing Shutter action and the opening Shutter action to complete the liquid storage and liquid discharge process respectively, and the etching efficiency is relatively low. Second, when draining, the shutters at both ends of the etching tank are quickly opened, which can easily cause uneven flow of etching liquid on the glass substrate, resulting in the formation of mura on the product; third, the existing immersion etching equipment has no standard etching End point judgment unit, the etching end point is generally judged by human eye observation, so the judgment result is very inaccurate

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