Photoelectric conversion module for realizing optical power monitoring and manufacturing method thereof

Abstract

The invention discloses a photoelectric conversion module for realizing optical power monitoring and a manufacturing method thereof. The photoelectric conversion module comprises a PCB, an optical fiber array component, a laser, a detector, a flexible board and a metal bracket. The detector is mounted to a first surface of the flexible board. A part corresponding to the detector on a second surface opposite to the first surface of the flexible board is connected to a lower end face of a metal bracket. The metal bracket is welded to the PCB such that the detector is placed to face laser. The end face of each optical fiber of the optical fiber array component has an angle with a set degree relative to the detector or the laser such that a part of laser is refracted to a detection surface ofthe detector and a part of laser is subjected to full reflection to be transmitted through the fiber array component after the laser emitted by the laser is emitted to the end face, and the light emitting power monitoring and optical transmission of the photoelectric conversion module are realized with fewest optical components, a smallest optical surface and a smallest optical distance, and the reliability of an optical path is improved.

Description

technical field [0001] The invention belongs to the technical field of optical fiber communication, and in particular relates to a photoelectric conversion module for realizing optical power monitoring and a manufacturing method thereof. Background technique [0002] With the promotion and application of optical communication products, the demand for parallel photoelectric conversion modules is increasing day by day, and the market demand is also developing in the direction of continuous miniaturization, high speed, high density and high power. Among various optical module products , The monitoring of the life of the optical chip can enable customers to know the performance of the product in time. [0003] At present, the monitoring of the life of the optical chip is realized by monitoring the luminous power of the optical chip. In the prior art, the beam is shaped by designing multiple sets of lenses, and the light is realized based on total reflection and beam splitting. ...

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Problems solved by technology

[0003] At present, the monitoring of the life of the optical chip is realized by monitoring the luminous power of the optical chip. In the prior art, the beam is shaped by designing multiple sets of lenses, and the light is realized based on total reflection and beam splitting. Power monitoring and optical transmission, but in the existing implementation, more optical path components and optical surfaces are required, and the optical path is longer, which reduces the reliability of the optical path

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