Stirring process based on solder paste production

Abstract

The invention relates to the technical field of solder paste production and processing, and discloses a stirring process based on solder paste production. The stirring process is carried out by a solder paste stirring device which comprises a stirring barrel, a stirring shaft, a discharging box, a rack and a motor, wherein the stirring barrel is fixedly mounted on the rack; the stirring shaft is mounted in the stirring barrel; the discharging box is located above the stirring barrel and is fixedly connected with a lower part of the motor; the motor is fixedly mounted on the rack; an airbag isarranged on one side of the stirring barrel; an air cavity communicated with the airbag is formed in the stirring barrel; a dispersing mechanism is arranged on a side wall of the stirring barrel; thedispersing mechanism comprises a fixed base, a rubber bag and an extruding part; an inner cavity communicated with the air cavity is formed in the fixed base; an air outlet check valve with an air outlet toward the stirring shaft is arranged on the fixed base; the extruding part is fixedly mounted on the rubber bag; the rubber bag is communicated with the inner cavity; a material cavity communicated with the discharging box is formed in the upper part of the stirring shaft; a discharge hole is formed in the side wall of the material cavity. The stirring process provided by the invention has agood stirring effect and reduces production of bubbles of solder paste.

Description

technical field [0001] The invention relates to the technical field of solder paste production and processing, in particular to a stirring process based on solder paste production. Background technique [0002] Solder paste is a paste mixture formed by mixing tin powder, flux and other surfactants, thixotropic agents, etc. Solder paste is mainly used in the soldering of electronic components such as surface resistors, capacitors, and ICs of PCB boards in the SMT industry, and has certain economic value. [0003] In the solder paste production process, it is necessary to mix tin powder and flux by stirring, and add a large amount of tin powder directly into the flux. Failure to stir evenly will cause some tin powder to fail to contact the flux in time. At the same time, during the storage of tin powder, the combination of water and tin powder will produce some hardened tin powder, hardened tin powder and flux are not easy to mix evenly, there is a certain gap between solder ...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a stirring process based on solder paste production to solve the problem of uneven mixing of solder paste and flux during the solder paste stirring process

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