Photosensitive assembly, shooting module group and manufacture method thereof

Abstract

Disclosed are a photosensitive assembly, a shooting module group and a manufacture method thereof. The photosensitive assembly comprises a circuit board body, a photosensitive chip and a connection medium, wherein the photosensitive chip is attached to the circuit board body through the connection medium, and the connection medium and the photosensitive chip are matched with each other in shape, so that the photosensitive chip is flatly connected to the circuit board body.

Description

technical field [0001] The invention relates to the field of camera modules, and further relates to a photosensitive component, a camera module and a manufacturing method thereof. Background technique [0002] The consistency of the optical axis is an important factor affecting the imaging quality of the camera module, and the consistency of the optical axis mainly refers to the coaxiality between the central axis of the photosensitive chip and the main optical axis of the lens, so D / A (Die / Attach chip The attachment) process is an important process in the assembly and manufacturing process of the camera module. [0003] refer to Figure 1A and 1B It is the chip and circuit board after the D / A process in the traditional camera. In a traditional camera module, a chip 1P is usually attached to a circuit board 2P, that is, a D / A process, that is, firstly, a thermosetting conductive adhesive or an insulating adhesive is coated on the surface 2P of the circuit board according t...

AI Technical Summary

Problems solved by technology

In this process, when molding the molding support 6P, the edge area of ​​the chip 1P will be pressed by the mold, and the chip 1P and the circuit through the traditional D / A process There is the floating area 4P between the boards 2P, and this kind of pressing can easily cause the chip 1P to tilt, and even cause the edge of the chip 1P to crack due to uneven force

Therefore, in order to ensure better optical axis consistency and chip reliability, on the one hand, the chip and the circuit board need to be bonded smoothly, and on the other hand, the pressing process precision of the molding process should be higher, but these still cannot Completely solve the problems that the traditional D / A process may bring to the camera module, such as optical axis inconsistency, poor resolution, abnormal curve, abnormal motor CODE, etc.

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