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Polyimide film with pyrimidine side group and preparation method thereof

A polyimide film and polyimide technology, applied in the field of polyimide film with pyrimidine side groups and its preparation, can solve the problems of high molecular chain rigidity, low elongation at break, poor flexibility, etc. Achieve high modulus, reduce packing density and improve elongation at break

Active Publication Date: 2018-07-03
JIANGHAN UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, among the polyimide materials that have been reported, the polyimide polymer used as a flexible display substrate material has excellent thermal stability and tensile strength, but its molecular chain rigidity makes the material brittle and fractures. Low elongation, poor flexibility

Method used

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  • Polyimide film with pyrimidine side group and preparation method thereof
  • Polyimide film with pyrimidine side group and preparation method thereof
  • Polyimide film with pyrimidine side group and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] At -15°C, p-phenylenediamine (10.8g, 0.1mol) and N-(2-pyrimidinyl)-2-(3-aminophenyl)-5-aminoindole (15.05g, 0.05mol) Dissolve the mixed diamine in 180g of strictly dry NMP, protect it under nitrogen, stir it mechanically until it is completely dissolved, and then add aromatic dianhydride {(aromatic dianhydride is a commercially available product), and the aromatic dianhydride is selected from 1, 2, 4 , 5-Pyromellitic dianhydride, the addition amount is (32.7g, 0.15mol) Continue stirring for 18h under the protection of nitrogen to obtain a polyamic acid solution.

[0044] After decompressing the above polyamic acid solution to eliminate air bubbles, apply it on clean glass with a film thickness of 150 microns, put it in an oven, and heat it to cure at 80°C for 360 minutes, 170°C for 60 minutes, and 230°C for 60 minutes. Cured at 300°C for 120 minutes, evaporated to remove the solvent, then cooled down to room temperature naturally, and peeled off to obtain a film.

Embodiment 2

[0045] Embodiment 2: In the implementation process, except that the aromatic dianhydride is selected from 3,3'-4,4'-biphenyl dianhydride, and its addition amount is different (44.1g, 0.15mol), the rest are the same as in Example 1.

Embodiment 3

[0046] Embodiment 3: In the implementation process, except that the aromatic dianhydride is selected from 3,3'-4,4'-diphenyl ether dianhydride, and its addition amount is different (46.5g, 0.15mol), the rest are the same as in Example 1.

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Abstract

The invention discloses a polyimide film with pyrimidine side groups and a preparation method thereof. The preparation method comprises the following steps: 1) under the protection of nitrogen or argon, aromatic diamine and N-pyrimidine-containing indium The diamine of the azole structure is mixed into a mixed diamine, and the mixed diamine is dissolved in a polar solvent and completely dissolved at -15°C -100°C to obtain a mixed solution; 2) Add an aromatic dianhydride to the mixed solution to maintain The temperature of the reaction system is reacted at -15°C-100°C for 5-24h to obtain a polyamic acid solution; 3) cast or scrape the polyamic acid solution on a glass substrate to form a film, heat imidization by temperature programming, and wait for the temperature to rise After the program is completed, the temperature is naturally lowered to room temperature, and the polyimide film with pyrimidine side groups is obtained after peeling off. The present invention introduces pyrimidine rings into polyimide, reduces molecular chain packing density, improves material flexibility, and the prepared polyimide material containing pyrimidine side groups has high heat resistance, dimensional stability and high flexibility, and can be used As a flexible display substrate material.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a polyimide film with pyrimidine side groups and a preparation method thereof. Background technique [0002] Polyimide is a high-performance polymer material with excellent chemical stability, thermal stability and high mechanical strength, and has been widely used in aerospace, microelectronics and chemical industries. In recent years, the research on the use of polyimide thin films as flexible display substrate materials has attracted much attention. The substrate material used for top-emitting flexible displays does not require colorless and transparent, but the high-temperature display process requires polyimide to be extremely high-temperature resistant, and the substrate is required to be flexible and resistant to bending. [0003] However, among the polyimide materials that have been reported, the polyimide polymer used as a flexible display substrate material h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08G73/1028C08G73/1039C08G73/1067C08G73/1071C08J5/18C08J2379/08
Inventor 刘继延陈妤红尤庆亮付华阮敏王亮刘学清
Owner JIANGHAN UNIVERSITY
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