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LED module and method for pouring glue on surface of LED module

An LED module and glue filling technology, which is applied to devices and coatings for coating liquid on the surface, can solve the problems of high cost, cumbersome process, unsatisfactory glue filling process effect, etc., and achieves low cost and simple method. Line, smooth surface effect

Active Publication Date: 2017-11-10
深圳市艾森视讯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the above-mentioned deficiencies of the prior art, and provide an LED module and its surface glue filling method, aiming at solving the unsatisfactory effect of the glue filling process of the existing LED module, and the technology with cumbersome process and high cost question

Method used

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  • LED module and method for pouring glue on surface of LED module
  • LED module and method for pouring glue on surface of LED module
  • LED module and method for pouring glue on surface of LED module

Examples

Experimental program
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Effect test

Embodiment 1

[0059] A glue filling mold is used to glue the light-emitting diode 9 on the surface of the LED module 1. The structure of the glue filling mold is as follows: figure 1 As shown, it includes the first mold part 2 and the second mold part 3 arranged up and down, the LED module 1 is fixed on the bottom of the first mold part 2, and the top of the second mold part 3 is provided with a cavity for containing glue 16 17. The bottom surface of the cavity 17 is a horizontal plane; a support plate 8 is provided on the left and right sides of the first mold part 2, and a horizontal bead is provided on the side of the LED module 1 (not marked in the figure). The four corners of the LED module 1 are provided with four first threaded holes 14, and the four corners of the first mold part 2 are provided with four mounting holes 4 corresponding to the positions of the first threaded holes 14; And the LED module 1 passes through the mounting hole 4 through the four bolts 6 and cooperates with ...

Embodiment 2

[0061] A glue filling mold is used to glue the light-emitting diode 9 on the surface of the LED module 1. The structure of the glue filling mold is as follows: figure 2 As shown, it includes the first mold part 2 and the second mold part 3 arranged up and down, the LED module 1 is fixed on the bottom of the first mold part 2, and the top of the second mold part 3 is provided with a cavity for containing glue 16 17. The bottom surface of the cavity 17 is a horizontal plane; a support plate 8 is provided on the left and right sides of the first mold part 2, and a horizontal bead is provided on the side of the LED module 1 (not marked in the figure). Four second threaded holes 15 are arranged in the middle of the four sides of the LED module 1, and magnets 7 are threaded inside each second threaded hole 15. The four magnetic parts 5; the four magnetic parts 5 are suction-connected with the four magnets 7 so that the first mold part 2 is fixedly connected to the LED module 1 .

Embodiment 3

[0063] A method for pouring glue on the surface of an LED module, comprising the steps of:

[0064] S31: Provide the LED module 1, the glue solution 16 and the glue filling mold in the embodiment 1 / embodiment 2.

[0065] S32 : Fix the LED module 1 on the first mold part 2 , make the light emitting diode 9 on the surface of the LED module 1 opposite to the second mold part 3 , and pour the glue 16 into the cavity 17 .

[0066] S33: Fitting the first mold part 2 and the second mold part 3 vertically together so that the light emitting diode 9 on the surface of the LED module 1 is immersed in the glue solution 16 facing downward, and then vacuum defoaming treatment is performed.

[0067] S34: After the glue solution 16 is solidified, perform a demoulding process on the glue-filled LED module 1 .

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Abstract

The invention belongs to the technical field of glue pouring, and particularly relates to an LED module and a method for pouring glue on the surface of the LED module. The method for pouring the glue on the surface of the LED module comprises the steps that the LED module, the glue and a glue pouring mold are provided, wherein the glue pouring mold comprises a first mold component and a second mold component which are arranged up and down, a cavity is formed in the top of the second mold component, and the bottom surface of the cavity is a horizon plane; the LED module is fixed to the first mold component, light-emitting diodes on the surface of the LED module are made opposite to the second mold component, and the glue is poured into the mold cavity; the first mold component and the second mold component are matched up and down, so that the light-emitting diodes on the surface of the LED module are made to be downwards immersed in the glue; and after the glue is solidified, the LED module is separated from the mold. According to the LED module and the method for pouring the glue on the surface of the LED module, the surface of a glue layer formed after glue pouring of the LED module is made smooth and flat, the light-emitting diodes are better protected, and polishing is not needed after glue pouring.

Description

technical field [0001] The invention belongs to the technical field of glue filling, and in particular relates to an LED module and a surface glue filling method thereof. Background technique [0002] The LED module is a product formed by arranging light emitting diodes (Light Emitting Diode, LED) together according to certain rules and then packaging them together, and adding some waterproof treatment processes. LED module is a widely used product in LED products. There are also great differences in structure and electronics. The simple one is to use a circuit board and shell equipped with LEDs to form an LED module. The more complicated one is There are also some controllers, constant current sources and related heat dissipation devices, which make the LED life and luminous intensity better. [0003] Since the light-emitting diodes on the existing LED modules are relatively fragile, there are related LED modules on the market that need to be protected by pouring glue on t...

Claims

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Application Information

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IPC IPC(8): B05C3/02B05C13/02B05C11/11B05C11/02
CPCB05C3/02B05C11/02B05C11/11B05C13/02
Inventor 李付民杨承华
Owner 深圳市艾森视讯科技有限公司
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