High test density circuit test board

Abstract

The invention provides a high test density circuit test board. The high test density circuit test board comprises a first substrate, a first insulation layer, a first wiring layer, a second insulation layer and a plurality of conductive cones; a plurality of lower electrodes and a plurality of upper electrodes are respectively arranged on a lower surface and an upper surface of the substrate; the lower electrodes are electrically connected to the upper electrodes; the first insulation layer is arranged on the upper surface of the substrate; the wiring layer is formed on the first insulation layer and the part of the upper electrodes are electrically connected through at least one first connector; the second insulation layer is arranged on the first insulation layer; and the conductive cones are formed on the second insulation layer in a matrix manner and is electrically connected to the wiring layer through at least one second connector. Through line arrangement of the wiring layer, the first connector and the second connector, electric test electric power is provided to part of the conductive cones and the electric test density is improved through the conductive cones.

Description

technical field [0001] The invention relates to a circuit test board, in particular to a circuit test board with high test density. Background technique [0002] The electrical test of the circuit board is one of the basic procedures for making the circuit board. It is used to check whether the circuit board can work smoothly. Therefore, it needs correct and complete tools to support it. In the electrical test, a circuit board is often stacked on a measurement On a test fixture of the device, the measuring device transmits power to the test fixture, and the test fixture selectively transmits power to electrodes or points to be tested on the circuit board to perform electrical testing on the circuit board. Please refer to Figure 5 As shown, the current test fixture 70 includes a bottom plate 71 , two spring elements 72 , a lift plate 73 , a plurality of telescopic probes 74 , and a mask plate 75 . The base plate 71 is formed with a plurality of concave holes 76, and the con...

AI Technical Summary

Problems solved by technology

[0010] It can be seen from the above description that the current circuit board testing device has the problem of insufficient test density. If the telescopic probe is tilted, it will be easy to wear, damage the structure of the probe, or cause poor contact with the electrodes of the circuit board due to insufficient length. In view of the problem of inaccessibility, the present invention provides a circuit test board with high test density to improve the above problems

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