Chip package and method for forming the same

Abstract

The invention provides a chip package and a method for forming the same. A chip package including a substrate is provided. A sensing region or device region of the substrate is electrically connected to a conducting pad. A first insulating layer is disposed on the substrate. A redistribution layer is disposed on the first insulating layer. A first portion and a second portion of the redistribution layer are electrically connected to the conducting pad. A second insulating layer conformally extends on the first insulating layer, and covers side surfaces of the first portion and the second portion. A protection layer is disposed on the second insulating layer. A portion of the second insulating layer is located between the protection layer and the first insulating layer. The quality and the reliability of the chip package can be greatly improved.

Description

technical field [0001] The present invention relates to a semiconductor packaging technology, in particular to a chip package and a manufacturing method thereof. Background technique [0002] The chip packaging process is an important step in the process of forming electronic products. In addition to protecting the chip therein from external environment pollution, the chip package also provides an electrical connection path between the electronic components inside the chip and the outside world. For example, there are wires in the chip package to form a conductive path. As electronic products gradually develop toward miniaturization, the size of chip packages is also gradually reduced. [0003] However, when the size of the chip package shrinks, the thickness and width of the wires become smaller, and the distance between the wires also becomes narrower, so that circuit faults are likely to occur in the densely populated circuit area. For example, electromigration and / or G...

AI Technical Summary

Problems solved by technology

[0003] However, when the size of the chip package shrinks, the thickness and width of the wires become smaller, and the distance between the wires also becomes narrower, so that circuit failures are prone to occur in the densely populated wiring area.

For example, electromigration and / or Galvanic effect may occur between wires made of metal, which may cause electrical short circuit and / or open circuit, resulting in chip package Body quality and reliability decrease

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