Bending copper substrate PCB manufacture method

A production method, copper-based technology, applied in the direction of multilayer circuit manufacturing, printed circuit manufacturing, electrical components, etc., can solve the problems of increasing manufacturing costs and difficulty in ensuring connection reliability, so as to ensure the bending effect and provide stable products efficiency and streamline workflow

Active Publication Date: 2017-08-18
SHENZHEN SUN & LYNN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the limited installation space of electric vehicle batteries, battery PCBs are required to be highly integrated. Usually, electric vehicle batteries require a combination of multiple PCBs, which not only increases manufacturing costs, but also makes it difficult to connect various PCB boards. Guaranteed, although bending a PCB can take into account the battery installation space, at the same time meet the reliability and stability of the battery work

Method used

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Examples

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Embodiment Construction

[0019] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0020] The invention provides a method for manufacturing a bent copper-based PCB, comprising steps:

[0021] First make the copper substrate: select the copper substrate for material cutting, then drill holes on the copper substrate, and make the outer layer graphics, then perform graphic etching, form circuit graphics on the upper and lower layers of the copper substrate, and then press and fill the glue The holes of the copper substrate are plugged, and then the browning baking plate is used for standby;

[0022] Secondly, the common FR4 board substrate is used for cutting, and then the inner layer is etched to etch away...

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PUM

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Abstract

The invention provides a bending copper substrate PCB manufacture method. The bending copper substrate PCB manufacture method comprises steps of manufacturing a copper substrate, a manufacturing an optical plate, manufacturing a ruler, successively placing a PP, the optical plate, the copper substrate, a PP and a copper foil on copper foil to perform lamination and bending. The bending copper substrate PCB manufacture method uses laminating glue hole filling to replace resin hole filling, avoids water accumulating behind the resin-filled hole after browning, simplifies a working process and provides product stability. The bending copper substrate PCB manufacture method realizes the copper substrate PCB selective laminating through the optical plate and the ruler, and guarantees the bending effect of the copper substrate PCB.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and in particular relates to a production method of a bent copper-based PCB. Background technique [0002] With the rapid development of electric vehicles, higher requirements are put forward for the working stability of electric vehicle batteries, and electric vehicle battery PCB is one of the important factors that determine the working stability of batteries. Due to the limited installation space of electric vehicle batteries, battery PCBs are required to be highly integrated. Usually, electric vehicle batteries require a combination of multiple PCBs, which not only increases manufacturing costs, but also makes it difficult to connect various PCB boards to each other. Guaranteed, although bending a PCB can take into account the battery installation space, while satisfying the reliability and stability of the battery work. However, due to the limitations of its own cha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/00
CPCH05K3/0094H05K3/4602H05K3/4611H05K2203/068
Inventor 江燕平潘水良刘长春刘中丹
Owner SHENZHEN SUN & LYNN CIRCUITS
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