Manufacturing method for solid-state plasma diode equipped with table-shaped active region and used for preparing holographic antenna
A technology of holographic antenna and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, antenna, antenna parts and other directions to achieve the effect of good device performance
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Embodiment 1
[0058] See image 3 , image 3 It is a flowchart of a method for manufacturing a solid-state plasma diode in a table-shaped active region of a holographic antenna according to an embodiment of the present invention. The method is suitable for preparing a holographic antenna, and the solid-state plasma diode is mainly used for making a solid-state plasma antenna. The method comprises the steps of:
[0059] (a) select SOI substrate;
[0060] Among them, for step (a), the reason for using SOI substrate is that solid-state plasma antennas require good microwave characteristics, and solid-state plasma diodes need to have good carriers, that is, solid-state plasmas, in order to meet this requirement. capability, while silicon dioxide (SiO 2 ) can confine carriers, that is, solid-state plasma, in the top layer silicon, so SOI is preferably used as the substrate of solid-state plasma diodes.
[0061] (b) using a CVD process to form a first protective layer on the surface of the SO...
Embodiment 2
[0101] See Figure 4a-Figure 4s , Figure 4a-Figure 4s It is a schematic diagram of another manufacturing method of a solid-state plasma diode with a mesa-shaped active region for preparing a holographic antenna according to an embodiment of the present invention. The solid-state plasma diode in the area is taken as an example to describe in detail, and the specific steps are as follows:
[0102] S10, selecting an SOI substrate.
[0103] See Figure 4a , the crystal orientation of the SOI substrate 101 is (100), in addition, the doping type of the SOI substrate 101 is p-type, and the doping concentration is 10 14 cm -3 Yes, the thickness of the top Si layer is, for example, 20 μm.
[0104] S20, depositing a layer of silicon nitride on the surface of the SOI substrate.
[0105] See Figure 4b A silicon nitride layer 201 is deposited on the SOI substrate 101 by using a chemical vapor deposition (Chemical vapor deposition, CVD for short) method.
[0106] S30, etching the ...
Embodiment 3
[0142] Please refer to Figure 5 , Figure 5 It is a schematic diagram of another device structure of a solid-state plasma diode in a mesa-shaped active region for preparing a holographic antenna according to an embodiment of the present invention. The solid state plasma diode employs the above as image 3 made by the fabrication method shown. Specifically, the solid-state plasma diode is prepared and formed on the SOI substrate 301, and the P region 303, the N region 304 of the pin diode, and the I region laterally located between the P region 303 and the N region 304 are all located on the SOI substrate within the top layer of silicon 302 .
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