Chip scale package light-emitting apparatus having recessed design and manufacturing method thereof

Abstract

The invention provides a chip scale package light-emitting apparatus having recessed design and a manufacturing method thereof. The chip scale package light-emitting apparatus includes a flip chip type LED chip and a cladding structure. The cladding structure covers the LED chip, and has a bottom surface warps upwardly to for a recessed shape. The invention also provides a manufacturing method for manufacturing the light-emitting apparatus. The apparatus and the method can avoid or improve poor quality of welding points between the light-emitting apparatus and a substrate which is often caused by greater gap between an electrode group of the LED chip and a welding pad of the substrate due to expansion of the cladding structure upon being heated in reflow soldering or eutectic bonding. Therefore, the apparatus and the method can secure the electrode group to the substrate. With excellent welding quality, failure of electrical connection of the light-emitting apparatus can be avoided, the thermal resistance between the light-emitting apparatus and the substrate can be lowered, temperature at the binding point can be lowered when the light-emitting apparatus operates, and light-emitting efficiency and reliability can be improved.

Description

technical field [0001] The present invention relates to a light emitting device (light emitting device, LED) and a manufacturing method thereof, in particular to a chip scale packaging (CSP) light emitting device with a concave design and a manufacturing method thereof. Background technique [0002] LED (light emitting device) is commonly used to provide lighting sources or configured in electronic products as display light sources or indicator lights, and LED chips are usually placed in a bracket-type or ceramic substrate-type package structure, and are covered by a fluorescent The material wraps or covers to become a light emitting device (LED). The light-emitting device can be fixed to other structures such as a substrate by reflow soldering or eutectic bonding, so that electric energy can be transmitted through the substrate to drive the light-emitting device to emit light. [0003] With the evolution of LED technology, chip scale packaging (CSP) light-emitting devices ...

AI Technical Summary

Problems solved by technology

However, in the process of reflow soldering or eutectic bonding of existing CSP LEDs, the packaging structure covering the LED chip will expand due to heat; the expanded packaging structure will contact and push the substrate below it, which will cause LED damage. There is a large gap between the electrode and the pad of the substrate

This situation will cause the LED to not be properly soldered to the substrate, resulting in electrical connection failure or poor soldering quality, and the latter will cause higher electrical and thermal resistance, resulting in higher power consumption and poor heat dissipation of the LED, resulting in Reduced overall efficiency, which in turn reduces reliability

[0005] In order to improve the above problems, one possible way is to add a thick gold-tin bump under the electrode of the LED to raise the light-emitting device, so that the cladding structure expanded by heat will not touch the substrate during the soldering process, but Adding the gold-tin bump will significantly increase the material cost and reduce the manufacturing yield due to solder alignment

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