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Mixed dust collection system used in cutting process of circuit board substrate and using method thereof

A technology of cutting process and dust collection system, applied in the field of circuit board production, can solve the problems of large cost waste, indistinguishability, and high recycling value of aluminum powder, and achieve the effects of cost saving, simple structure and convenient use.

Pending Publication Date: 2017-07-14
南京市罗奇泰克电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the production process of circuit board substrates, a large amount of dust will be generated when cutting boards, and the recovery value of aluminum powder generated during the production of aluminum substrates is relatively large; the existing dust collection equipment cannot distinguish aluminum powder from ordinary powder, which is a waste of cost bigger

Method used

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  • Mixed dust collection system used in cutting process of circuit board substrate and using method thereof
  • Mixed dust collection system used in cutting process of circuit board substrate and using method thereof
  • Mixed dust collection system used in cutting process of circuit board substrate and using method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0027] Such as Figure 1-3 As shown, a mixed dust collection system used in the circuit board substrate cutting process, including an aluminum powder vacuum cleaner, a common powder vacuum cleaner, a first hose, a second hose, a dust chamber, a dust pipe and a dust hood; The dust collection chamber includes a first dust suction channel and a second dust suction channel, the first dust suction channel is connected with the aluminum powder vacuum cleaner through the first hose, and the second dust suction channel is connected with the ordinary powder vacuum cleaner through the second hose Connect; the first dust suction channel is provided with more than two first sockets, and the second dust suction channel is provided with more than two second sockets. The first socket and the second socket are round holes with the same diameter. Both are equipped with internal threads; there are more than two suction pipes and hoods, one end of each suction pipe is connected to the hood, and ...

Embodiment 2

[0037] It is basically the same as Example 1, except that the diameter of the dust suction pipe is 10 cm; the diameter of the bottom surface of the dust suction hood is 30 cm. .

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Abstract

The invention discloses a mixed dust collection system used in the cutting process of a circuit board substrate and a using method thereof. The mixed dust collection system comprises an aluminum powder dust collector, a common powder dust collector, a first hose, a second hose, a dust collection chamber, dust collection pipes and dust collection covers. The dust collection chamber comprises a first dust collection channel and a second dust collection channel. The first dust collection channel is connected with the aluminum powder dust collector through the first hose. The second dust collection channel is connected with the common powder dust collector through the second hose. The first dust collection channel is provided with two or more first inserting openings, and the second dust collection channel is provided with two or more second inserting openings. Both the first inserting openings and the second inserting openings are circular holes with the same caliber, and the circular holes are all provided with internal threads. The number of the dust collection pipes and the number of the dust collection covers are both two or more. One end of each dust collection pipe is connected with the corresponding dust collection cover, and the other end of each dust collection pipe is provided with external threads matched with the first inserting openings and the second inserting openings. The mixed dust collection system is simple in structure, convenient to use and capable of saving labor. Dust collection equipment can be replaced simply and quickly, so that aluminum powder is separated from common powder, and cost is reduced.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a mixed dust collection system used in the circuit board substrate cutting process and a method for using the same. Background technique [0002] In the production process of circuit board substrates, a large amount of dust will be generated when cutting boards, and the recovery value of aluminum powder generated during the production of aluminum substrates is relatively large; the existing dust collection equipment cannot distinguish aluminum powder from ordinary powder, which is a waste of cost larger. Contents of the invention [0003] Purpose of the invention: In order to overcome the deficiencies of the prior art, the present invention aims to provide a hybrid dust collection system used in the circuit board substrate cutting process and its application method. [0004] Technical solution: In order to solve the above-mentioned technical problems, the pres...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B15/00B23Q11/00
CPCB08B15/007B23Q11/0046
Inventor 楼方禄
Owner 南京市罗奇泰克电子有限公司
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