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Component supply device for exposed components and corresponding assembly system and assembly method

A component supply and component technology, applied in the direction of electrical components, electrical components, etc., can solve problems such as inability to pick up components, inaccuracy, damage, etc.

Active Publication Date: 2019-07-26
ASM ASSEMBLY SYST GMBH & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even a slightly inaccurate positioning of the tool can result in damage to at least one of the above, resulting in defective processing of the component tape and the inability to reliably pick up the component by the placement head

Method used

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  • Component supply device for exposed components and corresponding assembly system and assembly method
  • Component supply device for exposed components and corresponding assembly system and assembly method
  • Component supply device for exposed components and corresponding assembly system and assembly method

Examples

Experimental program
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Embodiment Construction

[0130] It should be noted that in the following detailed description, features or components of different embodiments (which are identical or at least functionally identical to corresponding features or components of other embodiments) are provided with the same reference signs or different reference signs, and the different reference A designation differs from a reference designation for an identical or at least functionally identical feature or component only by its first letter. In order to avoid unnecessary repetition, features or components which have already been explained with reference to the exemplary embodiments described above will not be explained in more detail below.

[0131] Furthermore, it should be pointed out that the embodiments described below are only selected from among the possible embodiments of the invention. In particular, it is possible to combine features of the individual exemplary embodiments with one another in a suitable manner, so that a multip...

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PUM

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Abstract

The present invention provides an element supply device. The elements are located in the recesses of an element strip which is provided with a carrier belt and a cover film, the first stripe portion of the carrier belt being covered by the cover film; a transmission hole is located in the adjacent second strip portion and is not covered by the cover film. The supply device comprises: a chassis; an element strip-drive which is provided in the chassis and has a transmission device capable of engaging with the transmission hole and transmitting the component strip in the transport direction during operation; a guide device which is provided on the chassis and provided next to the transmission device; the upper side of the second stripe portion of the element strip abuts against the lower side of the guide means); a tool which is provided at a fixed position in which the base frame is disposed at a fixed position with respect to the guide means, the element tape being machined by the tool, and the bearing belt recess is at least partially free of the cover film. A corresponding assembly system and an assembly process method are provided.

Description

technical field [0001] The invention relates to the technical field of automatic assembly of electronic components to component carriers. In particular, the present invention relates to a component supply device for continuously supplying electronic components to an assembly process, and an assembly system having at least one such component supply device. The invention also relates to a method for the continuous supply of electronic components in a component tape to an assembly process, in particular using such a component supply device. Background technique [0002] When mounting electronic components, especially so-called surface mount devices, on a component carrier, especially a circuit board, the components to be processed are continuously conveyed to a component mounting preparation position via a component supply device. At this position, the placement head of the placement machine picks up the ready component, transports it to the placement area of ​​the placement m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
CPCH05K13/0419
Inventor 布列姆·托马斯罗斯曼·托马斯伯格·斯蒂芬赖宁格·马库斯盖尔·斯蒂芬布拉赫曼·迈克尔
Owner ASM ASSEMBLY SYST GMBH & CO
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