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A Matching Method for Deformed Objects of IC Package Equipment

A technology for encapsulating equipment and matching methods, applied in the field of image matching, to achieve the effects of ensuring matching accuracy, improving matching speed, and solving similarity calculation problems

Active Publication Date: 2018-06-12
HUAZHONG UNIV OF SCI & TECH +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, the matching method decomposes the nonlinear transformation of the object in the entire target image into the linear transformation problem of each side of the polygon, which solves the similarity calculation problem in the matching, thereby realizing the fine matching of large deformation objects, while ensuring the matching accuracy Improved matching speed in case of

Method used

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  • A Matching Method for Deformed Objects of IC Package Equipment
  • A Matching Method for Deformed Objects of IC Package Equipment
  • A Matching Method for Deformed Objects of IC Package Equipment

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Embodiment Construction

[0043]In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

[0044] see Figure 1 to Figure 4 , the matching method suitable for deformed objects of IC packaging equipment provided by the preferred embodiment of the present invention, the matching method converts the matching of the target image into the matching of the object outline in the target image, extracts and compares the object outline in the template image and the target image The feature is in...

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Abstract

The invention belongs to the image processing related technical field, and discloses a matching method suitable for IC packaging equipment deformation objects; the method comprises the following steps: 1, extracting an object contour in a template image and an object contour in a target image; 2, obtaining a target fitting polygonoun and a template fitting polygonoun; 3, building a target image Hash table and a template image Hash table; 4, matching the target image with the template image; 5, calculating position coordinates of the central points of each edge of the target fitting polygonoun and the template fitting polygonoun in a corresponding reference center of mass polar coordinate system; 6, calculating gradient directions, linearity transformation matrixes and similarity fractions of each edge of the template fitting polygonoun and the target fitting polygonoun; 7, using the similarity fraction (step 6) weighted value to calculate the global similarity fraction of the non-linear transformation between the object in the target image and the object in the template image, if the global similarity fraction is bigger than a set threshold, the precise matching succeeds.

Description

technical field [0001] The invention belongs to the technical field of image matching, and more specifically relates to a matching method suitable for deformed objects of IC packaging equipment. Background technique [0002] IC (Integrated circuit) The integrated circuit industry is a high-speed growth point of the current global economic development and is widely used in various fields. IC packaging is one of the core links of the IC industry, and its technical level greatly affects the entire IC industry. With the rapid development of microelectronics technology, computer technology and communication technology, electronic products are rapidly developing in the direction of portable and miniaturization. The integration level of IC chips continues to increase, and higher requirements are put forward for IC packaging technology: 1. Improvement of information per unit volume (high density); 2. Improvement of processing speed per unit time (high speed). Correspondingly, IC p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06T7/00G06T7/33
CPCG06T7/001G06T2207/30148
Inventor 杨华尹周平卢锦张新乾
Owner HUAZHONG UNIV OF SCI & TECH
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