The structure and use method of wafer combination wheel of cleaning equipment after cmp

Abstract

The invention provides a CMP rear cleaning equipment wafer composite wheel structure and a use method. The structure comprises drive units forming a concentric circle with the center of a wafer and arranged in a leftwards-rightwards symmetrical manner and a driven unit forming a concentric circle with the center of the wafer and vertically arranged, and the wafer and the joint faces of the drive units and the driven face are longitudinally coplanar. Each drive unit comprises a drive shaft unit, a drive wheel unit in cup joint combination with the drive shaft unit and a pressing ring a for locking each drive wheel unit to the corresponding drive shaft unit. The driven unit comprises an idler shaft unit, an idler wheel unit in cup joint combination with the idler shaft unit, a pressing ring b for locking the idler wheel unit to the idler shaft unit and a sensor attached and fastened to the idler shaft unit. The drive units, the driven unit and a wafer external work environment are located in a spray agent medium. The drive units pull the wafer to perform centring rotation, the driven unit assists in bearing and clamping the wafer, and speed measurement tracking is performed along with rotation of the wafer. By means of the CMP rear cleaning equipment wafer composite wheel structure and the use method, concentric pulled rotation and online speed measurement racking can be performed on the wafer effectively and accurately.

Description

technical field [0001] The invention relates to a combined wheel structure used for dragging wafers in post-CMP cleaning equipment and a method for using the combined wheel structure. Background technique [0002] CMP (chemical mechanical Polishing) post-cleaning equipment is equipment for surface precision cleaning after high-precision polishing on the surface of electronic device wafers. In the currently available prototypes of foreign CMP post-cleaning equipment, the wafers are transported in place by an online manipulator and are separated, then slide into the combination wheel by their own weight. The friction degree on the circumference of the active rubber wheel of the existing drive unit is low, which easily causes the continuity of the concentric rotation of the supporting and rotating wafer to be unstable, that is, irregular throwing occurs, which directly affects the cleanliness of the wafer cleaning and the accuracy of speed measurement. The structure of the exi...

AI Technical Summary

Problems solved by technology

[0003] The invention provides a wafer combination wheel structure and usage method of post-CMP cleaning equipment, to solve the technical problem that the existing CMP post-cleaning equipment drive unit is prone to irregular throwing phenomenon when the wafer is rotated concentrically; Jamming occurs, and the wafer idler wheel swings greatly, which affects the technical problems of speed measurement accuracy

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