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Cooling device and electronic device

A technology for heat dissipation devices and electronic equipment, which is applied to structural components of electrical equipment, electrical components, cooling/ventilation/heating transformation, etc. It can solve the problems of high cost of fans, various production processes, and complex fan mechanisms, and achieve low production costs. , easy system layout, and simple production process

Inactive Publication Date: 2017-05-17
HEFEI LCFC INFORMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] (1) The shape of the fan is relatively fixed, and the length, width and height determine the minimum thickness of the product, which is not conducive to the overall layout of the system;
[0004] (2) The structure of the fan is complex, including fan blades, fan frame, PCB board, rotating shaft, motor, etc., resulting in multiple defects;
[0005] (3) The fan is composed of mechanical parts and electronic parts, and its production process is various and complicated;
[0006] (4) Due to the complex fan mechanism and various production processes, the cost of the fan is very high

Method used

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  • Cooling device and electronic device
  • Cooling device and electronic device
  • Cooling device and electronic device

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Embodiment Construction

[0035] Below, specific embodiments of the present invention will be described in detail in conjunction with the accompanying drawings, but they are not intended to limit the present invention.

[0036] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and, together with the general description of the disclosure given above and the detailed description of the embodiments given below, serve to explain the embodiments of the disclosure. principle.

[0037] These and other characteristics of the invention will become apparent from the following description of preferred forms of embodiment given as non-limiting examples with reference to the accompanying drawings.

[0038] It should also be understood that while the invention has been described with reference to a few specific examples, those skilled in the art can certainly implement many other equivalent forms of the invention, which have the...

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PUM

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Abstract

The invention provides a cooling device and an electronic device. The cooling device comprises a first chamber, a second chamber and a drive device for driving an elastic membrane to vibrate, wherein the first chamber and the second chamber are spaced apart through the elastic membrane; and the drive device is arranged to form intake airflow in one of the first chamber and the second chamber and to form outlet airflow in the other chamber separately through driving alternate vibration of the elastic membrane in two opposite directions. The cooling device and the electronic device have the characteristics that the structures are simple and continuous air can be provided.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a heat dissipation device and electronic equipment. Background technique [0002] With the rapid development of the field of smart electronic devices, the design of electronic devices tends to be thinner and lighter. In order to cooperate with various novel appearance designs of electronic equipment, and facilitate the layout of electronic components and structural components in the system, the configuration requirements of heat dissipation devices are also gradually inclined to miniaturization. Existing cooling devices generally adopt a fan structure, which has the following disadvantages: [0003] (1) The shape of the fan is relatively fixed, and the length, width and height determine the minimum thickness of the product, which is not conducive to the overall layout of the system; [0004] (2) The structure of the fan is complex, including fan...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20145
Inventor 雷刚李宇
Owner HEFEI LCFC INFORMATION TECH
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