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Bonding structure and electronic device

An electronic equipment and bonding technology, which is applied to the structural parts, structural parts, circuits, etc. of electrical equipment, can solve the problems of increasing the difficulty of disassembly and damage of parts, and achieve the effect of reducing the difficulty of disassembly and avoiding damage

Inactive Publication Date: 2017-05-10
XIAOMI INC
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0003] However, in the maintenance and testing of electronic equipment, it is often necessary to disassemble the bonded parts, but due to the prior bonding treatment, it will increase the difficulty of disassembling these parts, and even cause damage to the corresponding parts

Method used

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  • Bonding structure and electronic device
  • Bonding structure and electronic device
  • Bonding structure and electronic device

Examples

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Embodiment Construction

[0030] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present disclosure as recited in the appended claims.

[0031] figure 1 is a schematic diagram of a three-dimensional structure of an adhesive structure shown according to an exemplary embodiment, such as figure 1 As shown, the bonding structure may include:

[0032] Adhesive portion 1; wherein, any position on the edge of the adhesive portion 1 protrudes outward and forms a handle portion 2 . As an exemplary embodiment, such as figure ...

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Abstract

The disclosure relates to a bonding structure and an electronic device. The bonding structure can comprise a bonding portion and a handle portion formed by outward protruding of any position on the edge of the bonding portion. The specification of the bonding portion matches that of a part to be bonded, so that the part to be bonded is adhered to a preset area in the electronic device through the bonding portion. The specification of the handle portion matches that of the part to be bonded, so that when the part to be bonded is adhered to the preset area, the handle portion reaches out between the part to be bonded and the preset area. Through the technical scheme of the disclosure, dismounting difficulties of parts in the electronic device are reduced, and parts that have been bonded are prevented from being damaged during dismounting.

Description

technical field [0001] The present disclosure relates to the technical field of terminals, in particular to an adhesive structure and electronic equipment. Background technique [0002] In order to fix the position of the components in the electronic equipment, it is often necessary to bond the corresponding components to the equipment body of the electronic equipment to avoid shaking and the like. [0003] However, when repairing and testing electronic equipment, it is often necessary to disassemble the bonded components, but due to the prior bonding process, it will increase the difficulty of disassembling these components, and even cause damage to the corresponding components. Contents of the invention [0004] The present disclosure provides an adhesive structure and an electronic device to solve the deficiencies in the related art. [0005] According to a first aspect of an embodiment of the present disclosure, there is provided an adhesive structure, comprising: ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/03H05K7/00H01M2/10
CPCH05K5/03H05K7/00H01M50/20Y02E60/10
Inventor 郑严王东亮史江通
Owner XIAOMI INC
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