A non-contact shock wave excitation device for testing the dynamic characteristics of mems metal microstructures

Abstract

The invention discloses a non-contact shock wave excitation device for testing the dynamic characteristics of MEMS metal microstructures. There is a needle electrode unit on the top, and the needle electrode points to the microstructure unit on the upper end of the support; the microstructure unit includes a fixed sleeve, and a mounting plate is installed on the ring-shaped step in the hole of the fixed sleeve. Circular through hole, MEMS metal microstructure is pressed on the mounting plate through the microstructure pressure plate; the needle electrode and the mounting plate are respectively electrically connected to the two poles of the high voltage capacitor, and a first air switch is arranged between the needle electrode and the high voltage capacitor Control on-off; the two poles of the high-voltage capacitor are electrically connected to the positive and negative poles of the high-voltage power supply, and the on-off is controlled by the second air switch. The device can avoid the interference of the vibration response of the base structure on the test results, realizes the non-contact excitation of the metal microstructure, is easy and safe to operate, and has a good excitation effect.

Description

technical field [0001] The invention belongs to the technical field of micromechanical electronic systems, in particular to a non-contact shock wave excitation device for testing the dynamic characteristics of MEMS metal microstructures. Background technique [0002] Due to the advantages of low cost, small size and light weight, MEMS microdevices have broad application prospects in many fields such as automobile, aerospace, information communication, biochemistry, medical treatment, automatic control and national defense. For many MEMS devices, the micro-displacement and micro-deformation of their internal microstructures are the basis for the realization of device functions. Therefore, accurate testing of dynamic characteristic parameters such as the amplitude, natural frequency, and damping ratio of these microstructures has become the key to developing MEMS products. important content. [0003] In order to test the dynamic characteristic parameters of the microstructure...

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Problems solved by technology

However, the device still has the following disadvantages: First, the device excites the microstructure by means of base excitation, so the vibration response signal of the microstructure obtained by the non-contact optical vibration measurement method will include the base The vibration response of the structure, which will make it difficult to obtain the dynamic characteristic parameters of the microstructure; second, in the device, the feeding mechanism can only be adjusted manually, and automatic feeding cannot be realized, resulting in cumbersome discharge operations and poor safety; third , in the device, the microstructure is fixed by bonding. On the one hand, it will lead to poor connection stiffness, thereby reducing the excitation bandwidth of the excitation device. On the other hand, because the cured glue is not easy to remove, so if you want to Removal of the microstructure from the microstructure mounting plate becomes very difficult

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