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Self-pressurized semiconductor cooling cold-therapy system

A semiconductor, self-pressurizing technology, applied in the field of medical devices, can solve the problems of complex structure, inconvenient use, high price, etc., and achieve the effects of convenient portability, simple operation and low production cost

Inactive Publication Date: 2017-05-03
COMFORT ENERGY TECH SHENZHEN INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, pressurized cold therapy devices with air inflation and ice cooling are mostly used at home and abroad, but this kind of equipment has complex structure, expensive price and inconvenient use.

Method used

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  • Self-pressurized semiconductor cooling cold-therapy system

Examples

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Comparison scheme
Effect test

Embodiment Construction

[0010] The self-pressurized semiconductor cooling and cold therapy system includes heat dissipation bag (1), pressurized heat dissipation working medium (2), semiconductor cooling sheet (3), cooling cold therapy belt (4), cooling working medium (5), fastening Belt (6), heat-insulating fiber layer (7), semiconductor refrigeration controller (8), can realize the pressurization and cold therapy function to injured tissue, and the specific implementation method is as follows.

[0011] The cold end of the semiconductor refrigerating sheet (3) is close to the central part of the back side of the cooling cold therapy band (4). 5). The size of the cooling bag bar (1) is the same as that of the cooling and cold therapy band (4), and it is close to the hot end of the semiconductor cooling sheet (3). The cooling bag bar (1) is also bag-shaped, and it is filled with the High heat dissipation working medium (2), the heat dissipation working medium has better thermal expansion characterist...

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PUM

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Abstract

The invention discloses a self-pressurized semiconductor cooling cold-therapy system which comprises a radiating bag strip (1), a pressurized radiating medium (2), a semiconductor refrigerating plate (3), a cooling cold-therapy belt (4), a refrigerating medium (5), a fastening belt (6), a heat-insulating fiber layer (7) and a semiconductor refrigerating controller (8). When blood circulation of a wounded tissue of a patient needs to be reduced, the temperature of the wounded tissue needs to be reduced, and a bedridden patient is prevented from pressure sores, the self-pressurized semiconductor cooling cold-therapy system can be bound to the wound part through the fastening belt (6), the semiconductor refrigerating controller (8) is regulated, and the cooling cold-therapy belt (4) which clings to the wound part is refrigerated and cooled when the cold end of the semiconductor refrigerating plate (3) absorbs heat; meanwhile, the hot end of the semiconductor refrigerating plate (3) releases heat for increasing pressure of the pressurized radiating medium (2) in the radiating bag strip (1), so that the wounded tissue can be pressed, blood circulation can be reduced, and the temperature of the wounded tissue is reduced, the purposes of reducing pains and reducing cell death risks are achieved.

Description

technical field [0001] A self-pressurized semiconductor cooling and cold therapy system belongs to the field of medical equipment and is suitable for slowing down the blood circulation of damaged tissues of patients, lowering their temperature, and preventing and treating bed sores of long-term bedridden patients. Background technique [0002] When the human body is subject to local trauma that causes fractures, external bleeding, and tendon injuries, the blood circulation of the injured tissue is accelerated and swelling, pain, and muscle spasms occur. In addition to drug treatment, extrusion and local cooling are effective physical means to relieve pain. At present, pressurized cold therapy devices with air inflation and ice cooling are mostly used at home and abroad, but this type of equipment has a complicated structure, is expensive, and is inconvenient to use. Contents of the invention [0003] In order to make up for the deficiencies of the above-mentioned prior art...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61F7/10A61B17/132A61G7/057
Inventor 胡鹏童明伟智佳
Owner COMFORT ENERGY TECH SHENZHEN INC
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