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Semi-flexible printed board with rupture function and manufacturing method thereof

A production method and semi-flexible technology, which is applied in the fields of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of low production efficiency, high cost, flexural performance and reliability of semi-flexible printed boards, etc. , to save production process and time, reduce production cost, improve bending performance and reliability

Active Publication Date: 2017-02-22
SHENZHEN KINWONG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above deficiencies in the prior art, the object of the present invention is to provide a semi-flexible printed board with a bending function and its manufacturing method, aiming to solve the problem of low production efficiency and low cost of semi-flexible printed boards in the prior art. High, and the flexural performance and reliability still need to be improved

Method used

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  • Semi-flexible printed board with rupture function and manufacturing method thereof
  • Semi-flexible printed board with rupture function and manufacturing method thereof
  • Semi-flexible printed board with rupture function and manufacturing method thereof

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Embodiment Construction

[0022] The present invention provides a semi-flexible printed board with bending function and its manufacturing method. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0023] see figure 1 , figure 1 It is a flow chart of a preferred embodiment of a method for manufacturing a semi-flexible printed board with a bending function of the present invention. As shown in the figure, it includes steps:

[0024] S1. After the semi-flexible printed board is manufactured to the character process, the semi-flexible printed board is laser cut, and the excess substrate in the flexed area is ablated to realize the flexing function;

[0025] S2. After laser ablation, measure the remaining thickness of the flexure area ...

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Abstract

The invention discloses a semi-flexible printed board with a rupture function and a manufacturing method thereof. The manufacturing method comprises the following steps of A, manufacturing the semi-flexible printed board to a character procedure, cutting the semi-flexible printed board by laser, and ablating to remove the excessive substrate of a rupture area, so as to realize the rupture function; B, after laser ablation, measuring the allowance thickness of the rupture area, and detecting whether the semi-flexible printed board is qualified or not. The manufacturing method has the advantages that the manufacturing process and time are effectively saved, the efficiency is improved, the high manufacturing cost is effectively reduced, the rupture property and reliability are improved, and the problem of poor reliability of a terminal electronic product due to poor rupture property is solved.

Description

technical field [0001] The invention relates to the field of printed boards, in particular to a semi-flexible printed board with a bending function and a manufacturing method thereof. Background technique [0002] At present, the development trend of miniaturization, multi-function and high reliability of electronic products requires the packaging form of electronic products to develop into three-dimensional assembly. Combining the advantages of rigid boards and flexible boards, flexible printed boards can not only provide support for rigid circuit boards, but also achieve local bending, and are widely used in three-dimensional assembly of electronic products. Semi-flexible printed circuit board, also known as Semi-flex printed circuit board, is a kind of flexible printed circuit board. It is based on rigid multilayer board technology and is made of conventional rigid board materials without using expensive polyamide Imine-based flexible materials can reduce material and pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0026H05K2203/107
Inventor 刘羽王俊张霞康国庆
Owner SHENZHEN KINWONG ELECTRONICS
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