Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and apparatus for testing chip

A test device and chip technology, applied in the test field, can solve the problem of single test function

Active Publication Date: 2017-02-15
ANALOGIX CHINA SEMICON +1
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a chip testing method and device, to at least solve the technical problem of relatively single testing function in the prior art when testing TCON

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and apparatus for testing chip
  • Method and apparatus for testing chip
  • Method and apparatus for testing chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0022] It should be noted that the terms "first" and "second" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method and apparatus for testing a chip. The apparatus includes: a field-programmable gate array which is intended for generating at least one testing image for testing a to-be-tested chip; a data conversion apparatus which is in electrical connection to the field-programmable gate array through a first data transmission interface of the field-programmable gate array, and is intended for converting the image data of the testing image generated by the field-programmable gate array to an object signal; the to-be-tested chip which is in electrical connection to the data conversion apparatus through a second data transmission interface of the data conversion apparatus, and is intended for, based on the object signal, generating a control signal, wherein the control signal is intended for controlling a display to display the testing image. According to the invention, the apparatus addresses the singularity of the functions of testing TCON of prior art.

Description

technical field [0001] The invention relates to the testing field, in particular to a chip testing method and device. Background technique [0002] When using traditional automatic test equipment (Automatic Test Equipment, referred to as ATE) for testing, the BIST (Built-in SelfTest) embedded in the timing controller (Timing Control, referred to as TCON) is generally used to verify the basic functions of the TCON. However, since the BIST embedded in TCON is only some very simple test images, such as solid colors. Therefore, the test for the internal logic of the TCON product is very limited, and this test method cannot cover the test of the DP input interface of the TCON. And once a new problem occurs in the mass production process, it is impossible to add a new test plan on the premise that the traditional test platform does not change the hardware platform, and if a new hardware platform is designed, it will take extra time and cost, and the impact will be great. unpredi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/3185
Inventor 翟英张箭
Owner ANALOGIX CHINA SEMICON
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com