Semiconductor heat treatment equipment process door state detection device and detection method

A technology of heat treatment equipment and detection device, applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve the problems of time-consuming installation and adjustment, difficulty in levelness of the process gate, inconvenient for real-time observation, etc., and achieve economical leveling time, the effect of avoiding leveling errors

Active Publication Date: 2019-05-14
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When adjusting the levelness of the craft door, first pre-tighten the three springs according to past experience, and then rely on the level to adjust one by one. However, this method is very time-consuming for each installation and adjustment, and it is also very difficult to accurately ensure the levelness of the craft door.
In addition, since the buffer body does not have a ruler or any distance measuring tools, it is not convenient for real-time observation during installation and debugging

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor heat treatment equipment process door state detection device and detection method
  • Semiconductor heat treatment equipment process door state detection device and detection method
  • Semiconductor heat treatment equipment process door state detection device and detection method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] figure 2 It is a top view of the process door and the upper ranging sensor of the detection device according to an embodiment of the present invention. In the present invention, the lower end surface of the process door is connected with the support plate through the support structure, so that when the lifting device drives the support plate to lift, the process door also rises and falls along with the support plate. The detection device of this embodiment includes at least three upper ranging sensors and a detection unit. See figure 2 , the upper ranging sensor is arranged on the process door, specifically, three upper ranging sensors 6, 7, 8 are distributed on the side of the process door along the circumferential direction of the process door, and are located at the same height lower than the upper surface of the process door. In this embodiment, the upper ranging sensor is a photoelectric sensor, which measures the distance from the process door to the quartz tu...

Embodiment 2

[0048] Generally speaking, the process door has two typical working positions during use: the closed position of the process door and the original position of the process door (that is, the position used to take and place chips). This embodiment will detect the position accuracy and levelness state of the process door at the original position.

[0049] Figure 4 It is a top view of the process door and the lower ranging sensor of the detection device according to the second embodiment of the present invention. In the present invention, the lower end surface of the process door is connected with the support plate through the support structure, so that when the lifting device drives the support plate to lift, the process door also rises and falls along with the support plate. The detection device of this embodiment includes at least three lower ranging sensors and a detection unit. See Figure 4 , the lower ranging sensor is arranged on the process door, specifically, three l...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a semiconductor heat treatment equipment processing gate state detection device, which comprises upper distance measuring sensors and a detection unit. There are at least three upper distance measuring sensors arranged on the side face of the processing gate, located at the same height below the upper surface of the processing gate and distributed along the circumference of the processing gate. When the processing gate rises to the processing gate closing position in contact with a quartz tube flange at the lower end of the reaction tube of the semiconductor heat treatment equipment, the sensors measure the distance from the processing gate to the quartz tube flange. The detection unit, based on the measured values of the upper distance measuring sensors, detects the sealing state and / or the horizontal degree of the processing gate. With the invention, it is possible to rapidly and accurately detect the sealing degree and / or the horizontal degree of a processing gate in a technology process.

Description

technical field [0001] The invention relates to semiconductor heat treatment equipment, in particular to a semiconductor heat treatment equipment process door state detection device and detection method. Background technique [0002] Semiconductor heat treatment equipment is semiconductor equipment that performs heat treatment processes such as oxidation and annealing on silicon wafers. Generally speaking, semiconductor vertical heat treatment equipment supports a quartz boat full of silicon wafers through the process gate, and performs various heat treatment processes on silicon wafers in the thermal reaction tube. Among them, the function of the process door is to close the heat reaction tube, to prevent the loss of heat energy in the heat reaction tube, and the leakage of process gas or the entry of external air. [0003] The levelness of the process door is the main index to measure the installation quality of the process door, which directly affects the sealing of the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
CPCH01L22/12
Inventor 徐冬刘慧
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap