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Processing method of circuit board protective film

A processing method and technology of protective film, applied in the directions of printed circuit, printed circuit manufacturing, printed circuit secondary processing, etc., can solve the problems of wasting labor, low work efficiency, troublesome operation, etc., saving labor, improving work efficiency, eliminating The effect of convenient operation

Active Publication Date: 2018-08-14
重庆安洁电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, now generally in the later stage, manually cut the block-shaped silicone protective film and paste it on the raised part of the black glue, the operation is more troublesome, and a lot of labor is wasted, and the work efficiency is low

Method used

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  • Processing method of circuit board protective film

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Experimental program
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Effect test

Embodiment

[0023] Embodiment: the processing method of circuit board protective film, comprises the following steps:

[0024] The first step is to use two first rollers to feed the raw materials of black glue and blue film respectively, wherein the black glue is pasted with release paper, and the black glue is located on the top of the blue film, and then the blue film and black film are simultaneously The glue is sent to the middle of the second roller, the blue film and the black glue are pressed together, and the air between the blue film and the black glue is evacuated. Wrap the end of the release paper around the third roller and move it counterclockwise. The black glue and other parts of the blue film continue to move forward. The release paper on the black glue is separated from the black glue, exposing the black glue away from the blue film. Rubber surface. At the same time, the release paper is fed above the black glue to form an anti-adhesive layer on the black glue. The black...

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Abstract

The present invention belongs to the electronic device protective film technical field and relates to a processing method of a circuit board protective film. The method includes the following steps that: first step, a first pressed film is formed; second step, die cutting is carried out; third step, material tearing off is carried out; fourth step, a second pressed film is formed; and fifth step, a third pressed film is formed. According to the processing method of the present invention, a silica gel protective film is pressed at a first protrusion in a protective film processing process. The processing method has the advantages of operational easiness and high working efficiency.

Description

technical field [0001] The invention relates to the technical field of protective films pasted on electronic equipment, in particular to a processing method for circuit board protective films. Background technique [0002] For electronic equipment represented by existing notebook computers and tablet terminals, the circuit board installed inside it is the core part of the electronic equipment. The existing circuit board is more integrated, which makes the circuit of the entire electronic equipment more miniaturized and intuitive. The circuit board is mainly composed of pads, vias, mounting holes, wires, components, connectors, fillings, electrical boundaries, etc., where the wires are used to connect the electrical network copper film of the component pins, and because the components in the circuit board More, a large number of wires are required for connection. In order to prevent the wires from lifting or falling off, a protective film is needed to fix the wires, so as to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/28
CPCH05K3/281H05K2203/1383
Inventor 谈克平
Owner 重庆安洁电子有限公司
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