Ultrathin camera module and manufacture method for the same

Abstract

The invention relates to an ultrathin camera module and a manufacture method. The ultrathin camera module comprises a camera lens, a camera lens seat, a circuit board, a photosensitive chip and a color filter; the color filter is positioned above the photosensitive chip; the photosensitive chip is installed on the circuit board; the circuit board and the camera lens are assembled through the camera lens seat; an assembly structure between the color filter and the photosensitive chip reduces the distance between the camera lens and the photosensitive chip, such that the thickness of the camera lens is smaller.

Description

technical field [0001] The present invention relates to a camera module, and further relates to an ultra-thin camera module realized by reducing the distance between a color filter and a photosensitive chip in the camera module. Background technique [0002] With the continuous development of electronic technology, various electronic products are developing towards thinner and lighter. Similarly, corresponding requirements have been put forward for the camera module industry. [0003] refer to figure 1 It is an existing conventional camera module. Normally, the camera module includes a lens base 1P, a lens 2P, a circuit board 3P and a photosensitive chip 4P. The lens 2P is installed on the lens base 1P, and the lens base 1P is installed on the The circuit board 3P and the photosensitive chip 4P are mounted on the circuit board 3P, that is to say, the lens 1P and the circuit board 3P are assembled through the lens holder 1P. The lens 2P is located above the photosensitive ...

AI Technical Summary

Problems solved by technology

The existence of the distance between the color filter and the photosensitive chip can protect the gold wire of the photosensitive chip from damage, but at the same time further reduces the amount of light reaching the photosensitive chip, and the light transmittance is low.

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