A stamping packaging automation integrated equipment

Abstract

The invention relates to automated stamping and packaging integrated equipment. The automated stamping and packaging integrated equipment comprises a support, a material belt feeding mechanism, a material belt dragging mechanism, an inverted stamping die, a material suction mechanism, a carrying belt feeding mechanism, a film covering mechanism and a carrying belt dragging mechanism. A material belt groove is formed in the support in the length direction of the support. The material belt feeding mechanism is arranged at an inlet of the material belt groove. The inverted stamping die is arranged in the middle of the material belt groove. Products are obtained through stamping of the inverted stamping die toward a material belt from bottom to top. The material belt dragging mechanism is arranged above the position, at the side of the inverted stamping die, of the material belt groove. A transverse-movement guide rail is transversely mounted at the position, above the inverted stamping die, of the support. The material suction mechanism is mounted on the transverse-movement guide rail in a matched manner. The support is further provided with a carrying belt groove. The carrying belt feeding mechanism is arranged at an inlet of the carrying belt groove. The film covering mechanism is mounted on the support and located at the side, close to an outlet of the carrying belt groove, of the transverse-movement guide rail. The carrying belt groove is further provided with the carrying belt dragging mechanism. The automated stamping and packaging integrated equipment has the beneficial effects that stamping and packaging are integrated, and labor cost and occupied space are saved.

Description

technical field [0001] The invention relates to the technical field of stamping and packaging of electronic components, in particular to an automated integrated equipment for stamping and packaging. Background technique [0002] SMD electronic components are usually stamped and formed, and then collected in the feeding mechanism, and then used as a carrier tape for packaging and transportation to meet the high-speed development needs of the SMT production line. Therefore, from production to packaging of SMD electronic components, at least two pieces of equipment are needed, one is stamping equipment, and the other is packaging equipment, so that the two pieces of equipment need at least two workers to operate, and there are transshipment costs in between, generally speaking , The production of SMD electronic components needs to go through two steps of stamping and packaging, the cost is high, and the production efficiency is low, and multiple devices occupy a large space. ...

AI Technical Summary

Problems solved by technology

Therefore, from production to packaging of SMD electronic components, at least two pieces of equipment are needed, one is stamping equipment, and the other is packaging equipment, so that the two pieces of equipment need at least two workers to operate, and there are transshipment costs in between, generally speaking , the production of SMD electronic components needs to go through two steps of stamping and packaging, the cost is high, and the production efficiency is low, and multiple devices occupy a large space

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