Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

A welding process and structural parts

A technology of welding process and structural parts, which is applied to the structural connection of printed circuits, electrical components, printed circuit components, etc., can solve the problems of reducing mechanical stress of solder joints, circuit board breaks, etc., to reduce mechanical stress and reduce mechanical stress. The effect of stress

Active Publication Date: 2018-09-28
SICHUAN JIUZHOU ELECTRIC GROUP
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present application provides a welding process and structural parts, which are used to solve the technical problem of electronic equipment in the prior art that the circuit board is disconnected due to external stress, and achieve the technical effect of reducing the mechanical stress of the solder joints

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A welding process and structural parts
  • A welding process and structural parts
  • A welding process and structural parts

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] Please refer to figure 1 , is a flow chart of a welding process provided in Embodiment 1 of the present application, and the welding process includes:

[0060] S101: Welding the first part of the flexible connector into the connection via hole of the horizontal printed board;

[0061] S102: Bending a second part of the flexible connector except the first part to obtain a bent part;

[0062] S103: Solder the upper end of the bent portion on the pad of the vertical printed board, wherein the length of the bent portion is greater than the distance between the connection via hole and the pad.

[0063] In the specific implementation process, the welding process can be specifically applied to the production of circuit boards in notebook computers or smart phones, and can also be applied to other electronic devices with printed boards in an orthogonal position relationship, such as Figure 2A and Figure 2B As shown, here, examples are not given one by one.

[0064] In the...

Embodiment 2

[0085] Based on the same inventive concept as Embodiment 1 of this application, please refer to Figure 7 , is a schematic diagram of a structural member provided in Embodiment 2 of the present application, and the structural member includes:

[0086] The horizontal printed board 10 has a via hole;

[0087] a vertical printed board 20 with pads;

[0088] A flexible connector 30 has a first end and a second end;

[0089] Wherein, the first end is pierced and welded in the via hole, the second end is welded on the pad, and the flexible connector is curved, and the length of the flexible connector is longer than the The distance between the via hole and the pad.

[0090] In the second embodiment of the present application, the first end is L-shaped.

[0091] In the second embodiment of the present application, the second end is arched, and the uppermost end of the arch is welded on the pad.

[0092] In the second embodiment of the present application, the flexible material i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a welding technology and a structural component. The welding technology comprises the steps that a first portion of a flexible connecting piece is welded to a connection via hole of a horizontal printed board; a second portion except for the first portion of the flexible connecting piece is bent, and a bent portion is obtained; the upper end of the bent portion is welded to a bonding pad of a perpendicular printed board, wherein the length of the bent portion is larger than the distance between the connection via hole and the bonding pad. The technical problem that a circuit board is likely to break due to external stress of electronic equipment in the prior art is solved, and the technical effect of lowering mechanical stress of a welding point is achieved.

Description

technical field [0001] The invention relates to the field of electronic product manufacturing, in particular to a welding process and structural parts. Background technique [0002] With the deterioration of the environment and the continuous improvement of product quality requirements, electronic products must undergo environmental tests such as vibration and temperature cycles after assembly. The mechanical stress and temperature stress brought about by the test process will cause certain deformations to the structural parts of the product. The deformation of the structural parts indirectly leads to a large mechanical stress between the vertical printed board and the horizontal printed board. [0003] In the prior art, the connection method of vertical printed board solder joints is generally to weld rigid silver-plated copper wires at the joints. The appearance of solder joints is required to be bright and burr-free. The welding method is as follows: figure 1 shown. In ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/36H05K1/14
CPCH05K1/141H05K3/366H05K2201/049H05K2201/1028H05K2201/10295
Inventor 许永强
Owner SICHUAN JIUZHOU ELECTRIC GROUP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com