Packaging structure and its manufacturing method

Abstract

A packaging structure and its manufacturing method are provided; the packaging structure comprises a dielectric layer having a first surface and a second surface opposite to each other; a wiring layer formed in the dielectric layer; an electronic element provided on the first surface of the dielectric layer and electrically connected to the wiring layer; a plurality of conductive posts disposed on a first surface of the dielectric layer and electrically connected with the wiring layer; a package colloid formed on the first surface of the dielectric layer and covering the electronic component and the conductive posts, wherein the package colloid is exposed on the top surface of the conductive post so as to connect with following other electronic units. The conductive posts are electrically connected with the wiring layer, thus solving the limited function problems caused by the existing packing structure can only face downward to connect other electronic elements.

Description

technical field [0001] The invention relates to a packaging structure and its manufacturing method, in particular to a stacked semiconductor packaging structure and its manufacturing method. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. Technologies currently used in the field of chip packaging, such as Chip Scale Package (CSP), Direct Chip Attached (DCA) or Multi-Chip Module (MCM), etc. type of packaging module. [0003] However, in the flip-chip packaging process, due to the large difference in thermal expansion coefficient between the chip and the circuit substrate, the bumps on the periphery of the chip cannot form a good bond with the corresponding contacts on the circuit substrate, so that the bumps may be peeled off from the circuit substrate. On the other hand, with the increase of the integration degree of the integrated circ...

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Problems solved by technology

[0013] In view of the lack of the above-mentioned prior art, the present invention provides a packaging structure and its manufacturing method to solve the problem of limited functions caused by the existing packaging structure that can only connect other electronic components downwards

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