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Preparation method for flexible display substrate

A flexible display and substrate technology, used in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as device failure, damage to thin-film transistors, and abnormal display of flexible displays, and achieve the effect of a small radius of curvature

Active Publication Date: 2016-11-16
BOE TECH GRP CO LTD
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  • Summary
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AI Technical Summary

Problems solved by technology

After the flexible display substrate is prepared, it is peeled off from the carrier substrate with a laser. During the peeling process, the laser often damages the thin film transistor, causing TFT Vth (thin film transistor threshold voltage) drift and device failure, making the flexible display display abnormal or even unable to work normally.
[0004] Moreover, the thickness of the flexible display substrate prepared according to the above method is uniformly large, so that the radius of curvature of the flexible display substrate is also relatively large, and the flexibility is poor.

Method used

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  • Preparation method for flexible display substrate
  • Preparation method for flexible display substrate
  • Preparation method for flexible display substrate

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preparation example Construction

[0035] see figure 1 , the preparation method of the flexible display substrate provided by the embodiment of the present invention includes:

[0036] Step 1, forming a concave-convex pattern layer on the rigid carrier base;

[0037] Step 2. Prepare a flexible display substrate on the rigid carrier base formed with the concave-convex pattern layer, the flexible display substrate contains a display device, and the pattern in the concave-convex pattern layer avoids the display device;

[0038] Step 3, peeling off the flexible display substrate and the rigid carrier base to obtain the flexible display substrate.

[0039] In the preparation method of the above-mentioned flexible display substrate, since the concave-convex pattern layer is formed on the rigid carrier base, and after the flexible display substrate is fabricated on the rigid carrier substrate, the patterns in the concave-convex pattern layer avoid the flexible display substrate. Therefore, stress concentration will ...

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Abstract

The invention discloses a preparation method for a flexible display substrate, relates to the technical field of the flexible display substrate, and solves the problem that a device on the flexible display substrate is damaged in peeling off the flexible display substrate and a rigid bearing substrate and the problem of relatively large radius of curvature of the flexible display substrate and the like. The preparation method comprises the steps of forming a concave-convex pattern layer on the rigid bearing substrate; preparing the flexible display substrate on the rigid bearing substrate where the concave-convex pattern layer is formed, wherein the flexible display substrate comprises a display device; the pattern in the concave-convex pattern layer avoids the display device; and peeling off the flexible display substrate and the rigid bearing substrate to obtain the flexible display substrate. The preparation method provided by the invention is used for preparing the flexible display substrate.

Description

technical field [0001] The invention relates to the technical field of flexible display substrates, in particular to a method for preparing a flexible display substrate. Background technique [0002] Flexible displays have the advantages of thinness, lightness and bendability, and have huge potential advantages in the future display market. Display substrates used in flexible displays are generally flexible display substrates. [0003] A general manufacturing method of a flexible display substrate is: firstly prepare a flexible display substrate on a carrier base, and then prepare thin film transistors and other devices on the flexible display substrate. For example, for a flexible OLED (organic light emitting diode) display substrate, thin film transistors and organic light emitting diodes usually need to be fabricated. After the flexible display substrate is prepared, a laser is used to peel it off from the carrier substrate. During the peeling process, the laser often d...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56
CPCH10K71/80
Inventor 赵策
Owner BOE TECH GRP CO LTD
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