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Electromagnetic compatibility analysis method of radio-frequency module backboard

An electromagnetic compatibility and radio frequency module technology, which is applied in the direction of measuring electricity, measuring electrical variables, and measuring external source interference, etc., can solve the problems of shortening the design cycle, long design cycle, and high time cost, so as to shorten the design cycle and save Time cost, the effect of improving design efficiency

Active Publication Date: 2016-10-26
BEIHANG UNIV
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Problems solved by technology

[0007] The technical problem of the present invention is: to overcome the problems of long design period and large time cost of the electromagnetic compatibility design method in the prior art, and provide an electromagnetic compatibility analysis method for the backplane of the radio frequency module, which analyzes the interface between the backplane port and the port Inter-correlation relationship, based on the interference signal, the electromagnetic compatibility requirements are put forward for the output of the module, which is targeted, shortens the design cycle, improves the efficiency of electromagnetic compatibility design, and greatly saves time and cost

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Embodiment Construction

[0026] An electromagnetic compatibility analysis method for a radio frequency module backplane of the present invention, the implementation steps are as follows:

[0027] (1) Prediction equation: In order to calculate the electromagnetic interference between the interference port and the sensitive port, the source function and the transfer function should be combined to obtain the effective power at the sensitive port, and then compare the obtained effective power with the sensitivity threshold, In order to determine whether there is potential electromagnetic interference.

[0028] (2) Interaction correlation matrix: S parameters can be used to describe the coupling degree between ports. For this purpose, an interaction correlation matrix can be constructed by designing and calculating S parameters between ports on the simulation backplane, and quantitatively describing each module on the backplane interference between different frequencies.

[0029] select figure 2 Taking ...

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Abstract

The invention relates to an electromagnetic compatibility analysis method of a radio-frequency module backboard. A prediction equation is established to determine an electromagnetic interference between an interference port and a sensitive port of the backboard, a source function and a transmission function are combined together, effective power at the sensitive port of the backboard is obtained, and then the obtained effective power is compared with a sensitivity threshold so that whether a latent electromagnetic interference exists is determined; if the effective power generated by the interference port at the sensitive port is less than the sensitivity threshold of a device, an electromagnetic compatibility state exists, otherwise, an interference problem exists; and a cross-correlation matrix is built through design for an S parameter between the various ports in a simulation backboard then, cross correlation, i.e., the relationship coupling degree, between the ports of the backboard is analyzed, interference conditions of various modules on the backboard at different working frequencies are determined, and then convenience is provided for subsequent targeted electromagnetic compatibility design. The electromagnetic compatibility analysis method is targeted; and electromagnetic compatibility analysis method is advantageous in that a design period is shortened, electromagnetic compatibility design efficiency is improved, and time cost is greatly saved.

Description

technical field [0001] The present invention studies an electromagnetic compatibility analysis method for a radio frequency module backplane, that is, by analyzing the interaction relationship between the ports of the backplane port and the port, and constructing an interaction correlation matrix between modules, based on this, research on the radio frequency module backplane for ringing Electromagnetic compatibility of conducted emissions of two basic interference signals, sine waves and sine waves. Background technique [0002] At present, electronic systems tend to be more and more standardized, modularized and miniaturized, especially in the integrated radio frequency system, the standardization and miniaturization are particularly prominent, and each device device with specific functions is integrated in the module, and these functional modules are uniformly inserted in the In a standard chassis, a set of power supply system is shared, and interconnected through the bac...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/00
CPCG01R31/001
Inventor 陈爱新刘欣赵越赵柯祺苏东林吴文斌
Owner BEIHANG UNIV
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