Sorting device and sorting method

A technology of crystal placement and work, applied in chemical instruments and methods, solid separation, classification, etc., can solve the problems of low picking efficiency and easy contamination of crystal grains, so as to reduce the probability of pollution, reduce time, and improve picking. The effect of efficiency

Inactive Publication Date: 2016-10-12
CHINA WAFER LEVEL CSP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the process of picking grains in the prior art, there are problems of low picking efficiency and easy contamination of grains

Method used

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  • Sorting device and sorting method

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Experimental program
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Embodiment Construction

[0049] It can be seen from the background art that the prior art has the problems of low picking efficiency and easy contamination of the grains in the process of sorting the grains.

[0050] Now combined with a grain sorting method for analysis, refer to figure 1 , figure 1 It is a structural schematic diagram of a die picking device, and the die picking method includes: providing a chip tray 10 (chip tray), on the first carrying surface 11 of the chip tray 10, a plurality of dies 12 to be picked are placed Provide a silicon wafer frame 20 (wafer frame), the second carrying surface 21 of the wafer frame 20 is used to place the picked grain 12; provide a picking mechanism 30, the picking mechanism 30 includes a rotating part 32 and The rotating part 32 is connected to the picking part 31, and the rotating part 32 drives the picking part 31 to move between the first carrying surface 11 and the second carrying surface 21. The to-be-picked die 12 on the tray 10 is picked and pl...

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PUM

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Abstract

The invention provides a sorting device and a sorting method. The sorting device comprises a first die accommodating plate, a second die accommodating plate and a sorting mechanism, wherein the first die accommodating plate comprises a first surface used for accommodating dies to be sorted; the second die accommodating plate comprises a second surface used for accommodating the sorted dies, and the second surface faces to the first surface; and the sorting mechanism comprises a rotating part and a sorting part connected with the rotating part, the rotating part rotates around a rotating center, the rotating center is positioned between the first surface and the second surface when the sorting mechanism conducts sorting operation, and the sorting part moves between the first surface and the second surface through rotation of the rotating part. The sorting device and the sorting method increase the die sorting efficiency, and reduce possibility that the dies are contaminated during the sorting operation.

Description

technical field [0001] The invention relates to the technical field of grain sorting, in particular to a sorting device and a sorting method. Background technique [0002] With the advancement of technology, there are more and more types and styles of electronic products today. In the manufacturing and production process of electronic products, manufacturers will equip production components with different qualities according to customers' quality requirements for products and their actual use needs. [0003] Different kinds of die or chips (also called chips) are commonly used in electronic products, and the dies are obtained by cutting wafers. After dicing the wafer to obtain multiple dies, they must be classified according to their quality, performance and product characteristics, so that the dies with different grades can be applied to different fields. For example, in the light-emitting diode (Light Emitted Diode, LED) industry, the luminance, wavelength, color tempera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67B07B13/14
CPCH01L21/67271B07B13/14
Inventor 王之奇
Owner CHINA WAFER LEVEL CSP
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