A packaging cover plate, its preparation method, and display device

Abstract

Embodiments of the present invention provide a package cover plate, a preparation method thereof, and a display device, which relate to the field of display technology, can increase the bending angle of the package cover plate, and can improve the problem that the inorganic layer is easily broken during long-term use. The packaging cover plate includes two first inorganic layers and at least two organic layers and at least one second inorganic layer between the two first inorganic layers, the first inorganic layer, the organic layer and the The second inorganic layers are in close contact and arranged alternately, and the upper surface of the organic layer in contact with the second inorganic layers has a plurality of grooves; along the direction of the bendable edge of the package cover, the grooves are spaced apart Arrangement; for any one of the organic layers and the second inorganic layer above and in contact with it, the thickness of the second inorganic layer is the same as the height of the grooves on the surface of the organic layer. Used in the manufacture of packaging cover plates and OLED display devices.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a packaging cover plate, a preparation method thereof, and a display device. Background technique [0002] Organic Light Emitting Diode (OLED) displays have the advantages of thinness, wide viewing angle, low power consumption, fast response speed, and flexible display. Therefore, OLED displays have been widely used in the display and lighting fields. [0003] The core component of an OLED display is an OLED device, which, as a new type of display device, has the advantages of high color gamut and high contrast. However, the luminescent materials and functional materials in the OLED device are sensitive to water and oxygen, so it is necessary to provide an encapsulation cover that blocks water and oxygen to form a protection for the OLED device. [0004] The package cover plate in the prior art, such as figure 1 As shown, a laminated structure in which the inorganic membrane 0...

AI Technical Summary

Problems solved by technology

However, since all the inorganic films 01 in this structure are flat planar structures, and the toughness of the inorganic films 01 is lower than that of the organic films 01, when all the inorganic films 01 are flat planar structures, this will result in The package cover of the structure has a small bending angle

Moreover, during long-term use, the inorganic film 01 is likely to break and cause the water and oxygen barrier function of the package cover to fail.

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