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Camera element and camera device

A technology for imaging elements and imaging conditions, which is applied in the field of electronic equipment, imaging devices and imaging elements, and can solve problems such as difficulty in application, difficulty in generating images, and insufficient convenience in the use of electronic equipment, so as to achieve a reasonable exposure effect

Active Publication Date: 2020-08-14
NIKON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in conventional electronic devices having a multi-layer image sensor, there are few proposals to acquire images by imaging in units of multiple blocks. For example, when capturing still images or moving images using the entire imaging area , it is difficult to generate images for display
Therefore, the usability of electronic equipment having a multilayer image sensor is insufficient.
[0009] In addition, in the conventional imaging device, it is difficult to apply to the case where an image is divided into blocks having one or two or more of the above regions and a captured image is acquired according to the blocks.

Method used

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  • Camera element and camera device
  • Camera element and camera device
  • Camera element and camera device

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Experimental program
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no. 1 approach -

[0071] Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. However, the present invention is not limited thereto. In addition, in the drawings, in order to describe the embodiment, a part may be enlarged or emphasized, and the scale may be changed appropriately. In addition, in each of the following embodiments, an interchangeable-lens digital camera will be described as an example of an electronic device.

[0072] figure 1 It is a sectional view showing an example of the imaging element 100 . Such as figure 1 As shown, the imaging element 100 has an imaging chip 113 that outputs a pixel signal corresponding to incident light, a signal processing chip 111 that processes the pixel signal output from the imaging chip 113, and a memory chip 112 that stores the pixel signal processed by the signal processing chip 111. . The imaging chip 113, the signal processing chip 111, and the memory chip 112 are stacked. The imaging...

no. 2 approach -

[0179]

[0180] First, the multilayer imaging device 100 mounted on an electronic device (for example, imaging device 1 ) according to a second embodiment of the present invention will be described. In addition, this multilayer imaging device 100 is an invention described in Japanese Patent Application No. 2012-139026 previously proposed by the applicant of the present application. Figure 13 is a cross-sectional view of the multilayer imaging device 100 . The imaging element 100 has: a back-illuminated imaging chip 113 that outputs pixel signals corresponding to incident light; a signal processing chip 111 that processes pixel signals; and a memory chip 112 that stores pixel signals. These back-illuminated imaging chip 113 , signal processing chip 111 , and memory chip 112 are stacked and electrically connected to each other via conductive bumps 109 such as Cu (copper).

[0181] In addition, as shown in the figure, the incident light is mainly incident toward the positive ...

Deformed example 1

[0250] The imaging device 1 of the above-described embodiment can be constituted by a multifunctional mobile phone or a tablet terminal. In this case, an imaging unit mounted on a multifunctional mobile phone (or a tablet terminal) is configured using the above-described multilayer imaging element 100 .

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PUM

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Abstract

The electronic device has: an imaging section having a region having a pixel group including a plurality of first pixels and second pixels less than the first pixels of the pixel group; process reads the signal after exposure by the second pixel.

Description

technical field [0001] The present invention relates to electronic equipment, an imaging device, and an imaging element. Background technique [0002] There is proposed an electronic device including an imaging element in which a back-illuminated imaging chip and a signal processing chip are laminated (hereinafter, the imaging element is referred to as a stacked imaging element.) (for example, refer to Patent Document 1). The multi-layer imaging element is stacked in such a way that a back-illuminated imaging chip and a signal processing chip are connected via microbumps in units of blocks in which a plurality of pixels are assembled. [0003] In addition, there is known an imaging device that includes a photoelectric conversion unit for image acquisition and a photoelectric conversion unit for luminance evaluation in an imaging element, and when the added (total) value of the signals repeatedly output from the photoelectric conversion unit for luminance evaluation is When ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/345H01L27/146H04N5/3745H04N23/12
CPCH01L27/14621H01L27/1464H01L27/14627H01L27/14634H01L27/14636H01L27/14645H04N23/673H04N23/63H04N25/44H04N25/79H04N23/84H04N25/134H04N23/73H04N23/12
Inventor 乡原幸一土谷聪志
Owner NIKON CORP
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