Base and plasma processing equipment

A pedestal and metal disc technology, which is applied in the manufacture of semiconductor/solid-state devices, discharge tubes, electrical components, etc., can solve the problems of reducing the service life of the metal disc 10, contaminating the substrate, increasing maintenance costs, etc., and achieving improved uniformity. performance, cost reduction, and the effect of changing RF coupling efficiency

Inactive Publication Date: 2016-07-20
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
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Problems solved by technology

Although this structure can improve the uniformity of etching to a certain extent, the exposed part of the insulating layer 13 will be etched in the proc

Method used

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  • Base and plasma processing equipment
  • Base and plasma processing equipment
  • Base and plasma processing equipment

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Embodiment Construction

[0023] In order to enable those skilled in the art to better understand the technical solution of the present invention, the susceptor and plasma processing equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0024] Plasma processing equipment can be used to perform processes such as thin film deposition and etching. figure 1 A schematic diagram of the plasma processing equipment used for etching. Such as figure 1 As shown, the plasma processing equipment includes a reaction chamber, the reaction chamber includes a reaction chamber 1, a metal ring part 2 and a dome-shaped insulating top cover 5, the dome-shaped insulating top cover 5 is arranged on the top of the reaction chamber 1, and the metal The annular component 2 is arranged between the reaction chamber 1 and the dome-shaped insulating top cover 5 . A cylindrical three-dimensional coil 4 is arranged around the outside of the dome-shaped insulatin...

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Abstract

The invention provides a base. The base comprises a metal circular disk with a lug boss, and insulating rings, wherein the insulating rings are nested on the outer sides of the lug boss; a concave part is arranged on the bearing surface of the metal circular disk; the depth of the concave part is variable in the radial direction of the metal circular disk. By adoption of the base, the uniformity of the processing technology can be improved; and furthermore, the base is low in cost and long in service life. In addition, the invention also provides plasma processing equipment.

Description

technical field [0001] The invention belongs to the microelectronic technology and relates to the field of semiconductor equipment manufacturing, in particular to a base and plasma processing equipment using the base. Background technique [0002] The inductively coupled plasma generator (ICP) can obtain high-density plasma at a low working pressure, and has a simple structure and low cost. Therefore, it is widely used in plasma etching (IC) and physical vapor deposition (PVD) , Plasma Chemical Vapor Deposition (CVD), Micro Electro Mechanical Systems (MEMS) and Light Emitting Diodes (LED) and other processes. [0003] In the PVD process, in order to increase the adhesion between the substrate and the film, reduce the resistance of the circuit, reduce heat loss and improve the performance of the chip. The substrate surface needs to be pre-cleaned before depositing the thin film. Such as figure 1 As shown, the inductively coupled plasma generator for pre-cleaning includes a...

Claims

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Application Information

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IPC IPC(8): H01L21/687H01J37/32H01J37/20
Inventor 常大磊陈鹏
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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