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Vapor deposition device

A technology of vapor phase deposition and reaction chamber, which is applied in gaseous chemical plating, metal material coating process, coating, etc., can solve the problems of limiting the range of reactant selection, reduce the difficulty of operation and the required cost, and be easy to implement , the effect of mild reaction conditions

Inactive Publication Date: 2016-06-22
TONGJI UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The reaction of CVD technology is usually carried out at a relatively high temperature (greater than 300 ° C) and often requires plasma or laser assistance. In the chemical vapor deposition reaction, the reactant itself is one or more gases, and there is no gasification of the reactant, but Greatly limit the range of choice of reactants

Method used

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  • Vapor deposition device

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Embodiment 1

[0027] A vapor deposition apparatus, such as figure 1 As shown, it includes a reaction chamber 1 , a reactant injection component, a vacuum decompression component and a temperature control component, and both the reactant injection component and the vacuum decompression component are in communication with the reaction chamber 1 . The material of the reaction chamber is metal

[0028] Wherein, the reactant injection assembly includes a reactant holding chamber 3, a gasification container 10, a liquid injection pipe 9 and a liquid injection valve 4 arranged on the liquid injection pipe 9, and the reactant containing chamber 3 and the liquid injection valve) are arranged in the reaction chamber Outside the body 1, the gasification container 10 is located inside the reaction chamber 1. One end of the liquid injection pipe 9 is connected to the reactant containing chamber 3, and the other end extends into the reaction chamber 1 and is arranged correspondingly to the gasification c...

Embodiment 2

[0033] This embodiment is basically the same as Embodiment 1, the difference is that one end of the vacuum tube 6 of this embodiment is connected to the vacuum pump 8, and the other end is directly connected to the reaction chamber 1, and the material of the reaction chamber 1 can be glass, quartz or plastic One of.

[0034] The vapor deposition device of this embodiment can realize the controllable progress of the vapor deposition reaction by changing the vacuum degree (pressure) and temperature of the reaction. The invention has simple steps and is easy to implement, and the device is small and portable, can be used as a reaction device for vapor deposition reaction, has a simple structure and low cost, and is suitable for large-scale commercial application.

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Abstract

The invention relates to a vapor deposition device which comprises a reaction cavity (1), a reactant injection assembly, a vacuum pressure reduction assembly and a temperature control assembly. The reactant injection assembly and the vacuum pressure reduction assembly communicate with the reaction cavity (1). A substrate (2) is placed into the reaction cavity (1), after the reaction cavity (1) is vacuumized through the vacuum pressure reduction assembly, the vacuum pressure reduction assembly is closed, the reactant injection assembly is used for injecting a reactant into the reaction cavity (1), and the temperature control assembly controls temperature in the reaction cavity (1), so that the reactant is vaporized and deposited on the surface of the substrate (2). Compared with the prior art, the vapor deposition device has the beneficial effects of being convenient to operate, simple in structure, low in cost, suitable for large-scale commercialized application and the like, and the vapor deposition process is controllable.

Description

technical field [0001] The invention belongs to the field of material preparation and chemical synthesis, and in particular relates to a simple and low-cost vapor deposition device. Background technique [0002] With the rapid development of science and technology, the properties of materials and their preparation processes have become the key factors restricting the further development of the manufacturing industry. Composite materials have incomparable advantages over single materials and have become a new research hotspot in material science. The preparation methods of composite materials are various, which can be divided into gas phase method, liquid phase method and solid phase method according to the reaction form of substances. Compared with liquid-phase and solid-phase methods, gas-phase methods are widely used due to the advantages of mild reaction conditions, controllable reaction process, and uniform reaction products. [0003] Vapor deposition method is a gas-p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/448C23C16/44
CPCC23C16/44C23C16/4485
Inventor 高国华毕文超武英杰张月柔吴广明沈军周斌
Owner TONGJI UNIV
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