Encapsulation structure of tungsten-rhenium film thermocouple sensor chip and production method thereof
A packaging structure and sensor chip technology, applied to thermometers that are directly sensitive to heat/magnetic elements, using electrical devices, circuits, etc., can solve the problem of small measurement range of temperature sensor chips, erosion and peeling of thermocouple films , easy failure and other problems, to achieve the effect of improving the temperature measurement range and service life, low packaging cost, and optimized performance
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[0024] The packaging structure of the tungsten-rhenium thin film thermocouple sensor chip of the present invention includes a sealing cap 1, a sensor chip 3, a high temperature resistant glass 4, a substrate 5, a tube shell 6, a high temperature compensation line 7, a protective sleeve 8 and a bonding ring 9; the upper surface of the substrate 5 is formed with a circular depression of the same size as the sensor chip 3, and the two are tightly bonded through the high temperature resistant glass 4; the inner upper surface of the sealing cap 1 is sputtered with a getter 2 , the sealing cap 1 is tightly bonded to the upper surface of the substrate 5 through the bonding ring 9; the high temperature compensation wire 7 is connected to the thermocouple electrode of the sensor chip 3, and the protruding high temperature compensation wire 7 is wound around the lower part of the substrate 5 The studs are fixed; the sealing cap 1, the sensor chip 3, the high temperature resistant glass 4...
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