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Encapsulation structure of tungsten-rhenium film thermocouple sensor chip and production method thereof

A packaging structure and sensor chip technology, applied to thermometers that are directly sensitive to heat/magnetic elements, using electrical devices, circuits, etc., can solve the problem of small measurement range of temperature sensor chips, erosion and peeling of thermocouple films , easy failure and other problems, to achieve the effect of improving the temperature measurement range and service life, low packaging cost, and optimized performance

Active Publication Date: 2016-06-08
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can solve the problems of small measurement range and low lifespan of the existing temperature sensor chip caused by the failure of tungsten and rhenium at high temperature, and the erosion and shedding of the thermocouple film, and realize the output function of collecting stable signals

Method used

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  • Encapsulation structure of tungsten-rhenium film thermocouple sensor chip and production method thereof
  • Encapsulation structure of tungsten-rhenium film thermocouple sensor chip and production method thereof
  • Encapsulation structure of tungsten-rhenium film thermocouple sensor chip and production method thereof

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Embodiment Construction

[0024] The packaging structure of the tungsten-rhenium thin film thermocouple sensor chip of the present invention includes a sealing cap 1, a sensor chip 3, a high temperature resistant glass 4, a substrate 5, a tube shell 6, a high temperature compensation line 7, a protective sleeve 8 and a bonding ring 9; the upper surface of the substrate 5 is formed with a circular depression of the same size as the sensor chip 3, and the two are tightly bonded through the high temperature resistant glass 4; the inner upper surface of the sealing cap 1 is sputtered with a getter 2 , the sealing cap 1 is tightly bonded to the upper surface of the substrate 5 through the bonding ring 9; the high temperature compensation wire 7 is connected to the thermocouple electrode of the sensor chip 3, and the protruding high temperature compensation wire 7 is wound around the lower part of the substrate 5 The studs are fixed; the sealing cap 1, the sensor chip 3, the high temperature resistant glass 4...

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Abstract

The invention discloses an encapsulation structure of a tungsten-rhenium film thermocouple sensor chip and a production method thereof. A round recess equivalent to a sensor chip in size is formed in the upper surface of a substrate of the encapsulation structure, and the two are tightly bonded through refractory glass; a getter is sputtered on the upper surface inside a sealing cap, and the sealing cap is tightly bonded with the upper surface of the substrate through a bonding ring; a high-temperature compensating wire is connected with a thermocouple electrode of the sensor chip; the protruding high-temperature compensating wire is fixedly wound on a stud at the lower part of the substrate; and the sealing cap, the sensor chip, the refractory glass, the substrate and the high-temperature compensating wire are together assembled with a tube shell face to face and bonded through refractory glass. Through the invention, the problems of small measurement range and short life of the existing temperature sensor chip caused by easy failure of tungsten and rhenium at high temperature and erosion drop of a thermocouple film and the like can be solved, and an output function of collecting stable signals is realized.

Description

technical field [0001] The technical field of sensor packaging of the present invention relates to a sensor chip, in particular to a package structure of a tungsten-rhenium thin film thermocouple sensor chip and a manufacturing method thereof. Background technique [0002] The health monitoring and diagnosis of aero-engines is an important means to ensure the safety of aircraft. By measuring the temperature in front of the turbine, which is a key parameter for health monitoring and diagnosis, it is helpful to realize the state monitoring of the aero-engine, provide effective state parameters for the damage of high-temperature flow path parts, and provide an important basis for evaluating the health state of the engine. However, the temperature of the internal flow path of the engine is high, the working environment fluctuates greatly, and it is accompanied by high-speed erosion of strong oxidizing gas. It is an extremely harsh environment, and real-time and accurate temperat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/02H01L23/31
CPCH01L23/31G01K7/02
Inventor 田边郑晨张仲恺任巍蒋庄德
Owner XI AN JIAOTONG UNIV
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