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Diode glue applying device

A diode and glue injection technology is applied in the field of diode gluing devices, which can solve the problems of incapability of batch gluing of diodes, high labor intensity of workers, and low gluing efficiency.

Active Publication Date: 2016-05-04
兴化市华圣电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages are: the gluing efficiency is low, the diodes cannot be glued in batches, the labor intensity of the workers is high, and it is easy to produce unqualified gluing diodes

Method used

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  • Diode glue applying device

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Embodiment Construction

[0011] The present invention will be described in further detail below by means of specific embodiments:

[0012] The reference signs in the drawings of the specification include: base 1 , support frame 2 , slide rail 3 , slide seat 4 , rubber tube 5 , positioning column 6 , energy-saving lamp 7 , control board 8 , and fixing seat 9 .

[0013] The embodiment is basically as attached figure 1 Shown: Diode gluing device, including base 1, control unit and gluing unit. The base 1 is a rectangular box, the control unit is located inside the base 1 , and the front side of the base 1 is provided with a control board 8 electrically connected to the control unit. The base 1 is fixed with a "door"-shaped support frame 2, the upper end of the base 1 is provided with a longitudinal slide rail 3, and the slide rail 3 is slidably connected with a fixed seat 9, and the slide rail 3 and the fixed seat 9 are located on the support under shelf 2. The fixing seat 9 is a rectangular aluminum ...

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PUM

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Abstract

The invention belongs to the diode manufacturing field and discloses a diode glue applying device. The diode glue applying device comprises a base, a control unit and a glue injection unit; the base is a rectangular box body; the control unit is located in the base; the front side of the base is provided with a control panel electrically connected with the control unit; an n-shaped supporting frame is fixed to the base; the upper end of the base is provided with a longitudinal sliding rail; the sliding rail is slidingly connected with a fixing seat; the sliding rail and the fixing seat are located below the supporting frame; the glue injection unit is slidingly connected with the top end of the supporting frame; the glue injection unit includes a sliding seat which can slide on the supporting frame; a vertically-mounted air cylinder is arranged in the sliding seat; the bottom end of the sliding seat is provided with a glue barrel and a hold clamp used for fixing the glue barrel; and the output end of the air cylinder is connected with the top end of the glue barrel. The operation of the device provided by the invention is simpler. With the device adopted, the labor intensity of workers can be reduced, glue applying efficiency can be improved, positioning and glue applying can be accurately performed on diodes arranged on the glue applying mold in a batched manner, and glue applying operation on the batched diodes can be completed fast.

Description

technical field [0001] The invention relates to the field of diode manufacturing, in particular to a diode gluing device. Background technique [0002] A diode is an electronic component, a device with two electrodes that only allows current to flow in one direction. The most common function of a diode is to only allow current to pass in a single direction (called forward bias), and to block it when it is reversed (called reverse bias). So a diode can be thought of as the electronic version of a check valve. [0003] In the existing production process of axial diodes, the process flow is: lead wire arrangement—chip screening—chip loading—welding—pickling—gluing—baking—plastic sealing—post curing— --Electroplating---Printing test--External inspection--Packaging. Among them, the gluing process refers to coating a layer of silicon rubber on the surface of the tube core after pickling and drying at high temperature to isolate the P-N junction of the tube core from the externa...

Claims

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Application Information

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IPC IPC(8): H01L21/56B05C3/09B05C13/02
CPCH01L21/56B05C3/09B05C13/02
Inventor 魏广乾
Owner 兴化市华圣电子有限公司
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