High-reliability flexible plate and assembling system thereof

Abstract

The invention relates to a high-reliability flexible plate and an assembling system thereof. The flexible plate comprises a main via hole, a standard pad, a non-standard pad, a through hole, and a silk-screen. The assembling system comprises a circuit board, a bottom plate, an assembly fixture and a pin. The circuit board comprises a pad, a positioning hole and a mounting hole. The pin is secured on the circuit board and is inserted into the through hole of the flexible plate so as to position the flexible plate. The fixture comprises an insulated pressing block, a sliding block, a driving rod, a supporting base, a supporting beam and a compression spring. During the upward displacement of the driving rod, the compression spring arranged in the sliding rail of the supporting base applies an upward pressure on the sliding block, and then the sliding block drives the insulated pressing block to move upwards. Meanwhile, the driving rod arranged on the supporting beam moves downwards to drive the sliding block and the insulated pressing block to move downwards inside the sliding rail of the supporting base. Therefore, the flexible plate and the circuit board are compressed and assembled. The high-reliability flexible plate easily meets the industry standards, and is easy to use, easy to manufacture and test, and reliable in performance.

Description

technical field [0001] The invention relates to a high-reliability flexible board and its assembly system meeting industry standards, especially for the connection of optoelectronic devices and modules with circuit boards. The invention belongs to the fields of communication and optoelectronics. Background technique [0002] In modern communications, low power consumption, high density, and integration have become the development trend of optoelectronic devices and even communication modules. In the case of limited space and volume, the flexible board can be bent and folded freely, can be freely arranged and stretched according to the layout requirements, and has good heat dissipation characteristics. The use of flexible boards in communication modules can effectively achieve dense assembly and connection of modules. . [0003] There is a problem: [0004] With the development trend of high integration of optoelectronic devices and communication modules, the size stipula...

AI Technical Summary

Problems solved by technology

And because the flexibility of multi-layer boards is much lower than that of single-layer boards, in the multi-process production and testing of optoelectronic devices and modules, repeated positioning and assembly will cause damage to flexible boards, which not only affects appearance, but also affects performance, leading to the use of flexible boards. Board products must be replaced with new flexible boards at high temperatures before they are sold. During the high temperature replacement process, it is easy to cause damage to the product again and cause it to fail.

Due to the above defects in flexible boards with high-density pads and their press-fitting methods, optoelectronic devices and communication modules are damaged or fail during the manufacturing and testing process, and the defect rate increases

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