Secondary etching double-face circuit board structure and production technology thereof

Abstract

The invention discloses a secondary etching double-face circuit board structure and the production technology thereof. The structure comprises a GTL circuit layer, an insulation PP layer and a GBL step surface circuit layer. The GBL step face circuit layer is formed by a GBL inner circuit layer and a GBL outer circuit layer. The GTL circuit layer and the GBL inner circuit layer are simultaneously connected with the insulation PP layer. The GBL outer circuit layer covers the GBL inner circuit layer. The production technology comprises following steps of primary circuit manufacture; circuit developing; circuit examination; acid etching; secondary circuit manufacture; circuit developing; circuit examination; etching; open short circuit electrical logging; and following working procedures. According to the invention, only the secondary manufacture is required; investment is less; production processes are simplified; task difficulty is reduced; production efficiency is improved; production cost is reduced; reject ratio of products is reduced; and production period of the products is shortened.

Description

technical field [0001] The invention relates to a circuit board production process, in particular to a secondary etching double-sided circuit board production process. Background technique [0002] In the current circuit board production process, double-sided circuit boards with GTL circuit layer, GBL internal circuit layer and GBL external circuit layer are all manufactured three times, and the circuit production is completed one by one. The cumulative error of production is very large, and the product quality is not good. In terms of management and control, the operation cycle is long, the production cycle is long, the production delivery time cannot be improved, and the cost investment is also large, which cannot meet customer requirements. In order to solve the above problems, a new type of superimposed circuit board line production update technology was developed to improve the reliability of PCB boards, and at the same time greatly reduce PCB production costs and short...

AI Technical Summary

Problems solved by technology

[0002] In the current circuit board production process, double-sided circuit boards with GTL circuit layer, GBL internal circuit layer and GBL external circuit layer are all manufactured three times, and the circuit production is completed one by one. The cumulative error of production is very large, and the product quality is not good. In terms of management and control, the operation cycle is long, the production cycle is long, the production delivery time cannot be improved, and the cost investment is also large, which cannot meet customer requirements.

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