Integrated circuit package structure and manufacturing technology thereof

Abstract

The invention provides an integrated circuit package structure and a manufacturing technology thereof, and the structure is film-pasting-free and electroplating-free and is based on the bonding wire connection. The structure comprises a silver plating layer which is mutually independent silver plating layer sections and chips which are arranged on some silver plating layer sections, the silver plating layer sections are connected through bonding wires, plastic package bodies are arranged on the peripheries of the chips, the silver plating layer, a nickel-palladium-gold plating layer and the bonding wires, and a power supply and a signal channel are formed by the chips, the silver plating layer, the nickel-palladium-gold plating layer and the bonding wires. The invention also provides the manufacturing technology of the above integrated circuit packaging, the packaging part provided by the invention is film-pasting-free and electroplating-free, so that the production cost can be greatly reduced, the product is more competitive than the prior art. The manufacturing technology is suitable for applying in integrated circuit packaging.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit packaging, and more specifically relates to a film-free and electroplating-free production process based on bonding wire connection. Background technique [0002] Integrated circuit flat no-lead packaging (QFN / DFN), in recent years, with communication equipment (such as base stations, switches), smart phones, portable devices (such as tablet computers), wearable devices (such as smart watches, smart glasses, Smart bracelets, etc.) are popularized and developed rapidly, and are especially suitable for the packaging of large-scale integrated circuits with electrical requirements such as high frequency, high bandwidth, low noise, high thermal conductivity, small volume, and high speed. Integrated circuit flat no-lead packaging (QFN / DFN) effectively utilizes the packaging space of the lead pins, thereby greatly improving the packaging efficiency. Due to the short leads, small size of the p...

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of the traditional QFN process that the thickness of QFN / DFN products is still relatively large and cannot meet the needs of current portable devices for small volume and high-density packaging, the present invention provides a film-free and electroplating-free technology based on bonding wire connection. Integrated circuit packaging structure and its production process

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