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Manufacturing method of laminated aluminum matrix composite for electronic packaging

An aluminum-based composite material and electronic packaging technology, applied in the field of aluminum-based composite material preparation, can solve the problems of poor weldability, low plasticity and toughness, and achieve the effects of low cost, good welding performance, and avoiding spalling

Active Publication Date: 2016-04-13
有研金属复材技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Aluminum-based composite materials for electronic packaging require at least 50% reinforcement content, but this leads to the plasticity and toughness of the material being significantly lower than that of the aluminum matrix. In addition, there are problems such as poor weldability when connecting with other parts, so it is necessary to develop A new layered aluminum matrix composite material to solve the above problems

Method used

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  • Manufacturing method of laminated aluminum matrix composite for electronic packaging
  • Manufacturing method of laminated aluminum matrix composite for electronic packaging

Examples

Experimental program
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Effect test

Embodiment 1

[0026] According to this embodiment figure 2 The preparation process of the layered aluminum-based composite material shown is carried out; the prepared silicon particle-reinforced layered aluminum-based composite material is composed of a 50% Si / Al layer, a 25% Si / Al layer and an Al layer. The preparation method adopts the following technical scheme: (1) uniformly mix silicon powder and aluminum powder according to a certain ratio, and the average particle size of silicon powder and aluminum powder is d 0.5 Both are 5.5μm; 50% Si / Al layer, powder according to mass ratio m Si :m Al = 1:1 mixed, 25% Si / Al layer, powder according to mass ratio m Si :m Al = 1:3 mixing; (2) Encapsulate the mixed powder in a cylindrical steel mold for cold pressing, the pressure is 10MPa, the thickness of each layer is about 3mm, the 50% Si / Al layer is in the upper part, and the 20% Si / Al layer is in the middle , the Al layer is in the lower part; (3) hot-press forming the billet formed by col...

Embodiment 2

[0029] According to this embodiment figure 2 The preparation process of the layered aluminum matrix composite material shown is carried out; the prepared silicon particle reinforced layered aluminum matrix composite material is composed of a 60% Si / Al layer, a 30% Si / Al layer and an Al layer. The preparation method adopts the following technical scheme: (1) uniformly mix silicon powder and aluminum powder according to a certain ratio, and the average particle size of silicon powder and aluminum powder is d 0.5 Both are 3μm; 60% Si / Al layer, powder according to mass ratio m Si :m Al = 3:2 mixed, 30% Si / Al layer, powder according to mass ratio m Si :m Al = 3:7 mixing; (2) Encapsulate the mixed powder in a cylindrical steel mold for cold pressing, the pressure is 10MPa, the thickness of each layer is about 5mm, the 60% Si / Al layer is in the upper part, and the 30% Si / Al layer is in the middle , the Al layer is in the lower part; (3) hot-pressing the cold-pressed billet, prot...

Embodiment 3

[0031] According to this embodiment figure 2 The preparation process of the layered aluminum-based composite material shown is carried out; the prepared silicon carbide particle-reinforced layered aluminum-based composite material is composed of a 70% SiC / Al layer, a 35% SiC / Al layer and an Al layer. The preparation method adopts the following technical scheme: (1) uniformly mix silicon powder and aluminum powder according to a certain ratio, and the average particle size of silicon carbide powder and aluminum powder is d 0.5 Both are 10μm; 70% SiC / Al layer, powder according to mass ratio m Si :m Al = 7:3 mixed, 35% SiC / Al layer, powder according to mass ratio m Si :m Al=7:13 mixing; (2) Encapsulate the mixed powder in a cylindrical steel mold for cold pressing, the pressure is 10MPa, the thickness of each layer is about 10mm, the 70% SiC / Al layer is on the upper part, and the 35% SiC / Al layer is in the middle , the Al layer is in the lower part; (3) hot-press forming the...

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Abstract

The invention relates to a manufacturing method of a laminated aluminum matrix composite for electronic packaging. The method includes the steps that reinforcement powder and aluminum matrix powder are evenly mixed according to different proportions, obtained composite powder with different reinforcement contents is sequentially packaged to cylindrical steel dies to be subjected to cold press molding, and cold press billets are subjected to hot press molding in the inert gas atmosphere, so that the density of the billets is increased, the hot press billets are degassed in a high-temperature vacuum manner and then subjected to hot isostatic pressing densification, and the completely-dense billets are manufactured. The manufacturing method is simple and low in cost, the quality is stable, and the composite has the characteristics of being high in strength and tenacity and good in welding performance and can be applied to the electronic packaging field.

Description

technical field [0001] The invention belongs to the technical field of aluminum-based composite material preparation, and in particular relates to a method for preparing a layered aluminum-based composite material for electronic packaging. Background technique [0002] Electronic packaging materials are used to carry electronic components and connecting lines. They have good electrical insulation, have mechanical support and environmental protection for chips, and play an important role in the thermal performance and reliability of devices and circuits. An ideal electronic packaging material must have comprehensive properties such as low density, high thermal conductivity, low thermal expansion coefficient, sufficient strength and stiffness, and low cost. [0003] Particle reinforced aluminum matrix composite material is an advanced material developed in recent years. The material has excellent comprehensive properties such as high specific strength, high specific stiffness,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/00C22C21/02C22C32/00C22C1/05B22F3/15B22F7/02
CPCB22F3/15B22F7/02B22F2998/10B22F2999/00C22C1/0416C22C1/05C22C21/00C22C21/02C22C32/0063B22F3/02B22F2003/145B22F2201/10
Inventor 魏少华樊建中马自力左涛刘彦强聂俊辉郝心想
Owner 有研金属复材技术有限公司
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