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Lower punching die for microphone printed circuit board (pcb)

A technology of pcb board and microphone head is applied in the field of stamping lower die of microphone head pcb board.

Inactive Publication Date: 2016-04-13
苏州市三生电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the circuit board, the switches of the produced microphone products are all reflected on the base material, and the number of panels for the CAM data operation is 320 small microphones, and the punching die is designed with 4 punch positioning holes to complete the positioning; its layout The utilization rate of the base material of the circuit board with through holes is low, which increases the cost of raw materials, and this type of circuit board needs secondary stamping, and the process positioning round hole and the process positioning waist hole for positioning on the edge of the forming board need to be stamped once , the second stamping is used to form pcb microphone products

Method used

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  • Lower punching die for microphone printed circuit board (pcb)
  • Lower punching die for microphone printed circuit board (pcb)

Examples

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Embodiment Construction

[0014] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0015] refer to figure 1 As shown in and , a stamping lower die 10 of a microphone pcb board, the stamping lower die 10 is provided with an upper left reference limit corner block 11, an upper right reference limit corner block 12 and a lower limit stopper 13, and the upper left reference The limit corner block 11 , the upper right reference limit corner block 12 and the lower limit block 13 are respectively arranged on the left upper part, the right upper part and the lower part of the stamping lower die 10 .

[0016] Both the upper left reference limit corner block 11 and the upper right reference limit corner block 12 are provided with an L-shaped rectangular surface 14 , 15 , and the lower limit block 13 is provided with at least one plane 16 .

[0017] One side of the L-shaped right-angled surface 14 of the upper left reference...

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PUM

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Abstract

The invention discloses a lower punching die for a microphone printed circuit board (pcb). The lower punching die is characterized in that the lower punching die is provided with an upper left basic limiting angle block, an upper right basic limiting angle block and a lower limiting check block; the upper left basic limiting angle block, the upper right basic limiting angle block and the lower limiting check block are located on the upper left portion, the upper right portion and the lower portion of the lower punching die respectively. The lower punching die can process circuit board base materials without technological plate edges, the punching process for positioning basic holes is eliminated, and the finished microphone pcb is directly formed; the number of punching procedures is small, the punching cost is low, the utilization rate of pcb materials is increased, and economic benefits are remarkable.

Description

technical field [0001] The invention relates to the field of stamping and forming of circuit boards, in particular to a stamping lower mold of a microphone PCB board. Background technique [0002] In the circuit board, the switches of the produced microphone products are all reflected on the base material, and the number of the CAM data operation panel is 320 small microphones, and the punching die is designed with 4 punch positioning holes to complete the positioning; its layout The utilization rate of the base material of the circuit board with through holes is low, which increases the cost of raw materials, and this type of circuit board needs secondary stamping, and the process positioning round hole and the process positioning waist hole for positioning on the edge of the forming board need to be stamped once , the second stamping is used to form pcb microphone head products. Contents of the invention [0003] The purpose of the present invention is to overcome the a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D37/10B21D43/00
Inventor 孙祥根
Owner 苏州市三生电子有限公司
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