Host as well as case and housing thereof

Abstract

The invention relates to a host as well as a case and a housing thereof. The case comprises a front cover plate, a rear cover plate and the housing arranged between the front cover plate and the rear cover plate, wherein the housing comprises an upper side plate and a lower side plate which are connected with the upper end and the lower end of a corresponding power module in a heat conduction manner; a heat dissipation pipe which runs through the upper and lower side plates in a vertical direction and is sealed in a circumferential direction is formed between the upper side plate and the lower side plate; the upper end and the lower end of the heat dissipation pipe are connected with the upper side plate and the lower side plate in a heat conduction manner respectively; and the front and rear cover plates and the housing define a sealed installation space. The invention provides the case which can improve the heat dissipation effects of power modules and is waterproof and dustproof, the housing used in the case, and the host using the case.

Description

technical field [0001] The invention relates to a host with heat dissipation function and its case and casing. Background technique [0002] There are many kinds of chassis, and one of the common chassis is VPX chassis. The VPX bus is a new generation of high-speed serial bus standard, which can process various data such as signals, images, and routing control at the same time. In order to ensure the normal operation of each power module, the heat dissipation characteristic is an important indicator of the VPX chassis. Existing VPX cabinets such as "a highly efficient heat dissipation VPX cabinet" disclosed in Chinese patent CN204102049U include a top cover, a base, and a housing arranged between the top cover and the base. The top cover and the base are respectively equivalent to the front cover and the base. The rear cover and the outer surface of the housing are provided with cooling fins, the inner surfaces of the upper and lower side plates of the housing are provided ...

AI Technical Summary

Problems solved by technology

[0003] The problem with the existing VPX chassis is that as the operating speed of each module inside the VPX chassis becomes faster and faster, the heat generated by it increases accordingly. Due to the dense arrangement of internal modules, heat concentration is easily generated inside the power module. The heat cannot be effectively conducted, which will cause the temperature of the power module to rise, which is not conducive to the operation of the equipment. In order to meet the requirements of dustproof and waterproof, it is not easy to open cooling holes on the shell

Images