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A method for evaluating the mechanical properties of metal-based copper-clad laminates

A copper-clad laminate, metal-based technology, applied in the direction of applying a stable bending force to test the strength of materials, etc., can solve the problem of inability to achieve accurate quantitative evaluation, inability to distinguish the bending properties of metal substrates, and inability to achieve quantitative evaluation, etc. Questions, to achieve the effect of simple and quick evaluation

Active Publication Date: 2019-07-26
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this test method cannot achieve accurate quantitative evaluation through observation. For example, the internal defects that appear after the bonding layer is bent cannot be judged. At the same time, it is a test sample without copper, so it is impossible to distinguish the overall bendability of the metal substrate.
Moreover, the test method is a qualitative assessment and cannot achieve quantitative assessment

Method used

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  • A method for evaluating the mechanical properties of metal-based copper-clad laminates
  • A method for evaluating the mechanical properties of metal-based copper-clad laminates
  • A method for evaluating the mechanical properties of metal-based copper-clad laminates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Cut the metal-based copper-clad laminate A to be tested into 6 samples with a width of 100 mm and a length of 100 mm, and etch the middle copper foil of the sample to be tested into a circle with a diameter of 50 mm.

[0033] Divide the samples to be tested into two groups (A1 and A2), with 3 pieces in each group, bend the A2 sample with the copper side outward and bend it at 90° with a bending radius of 2mm, and divide the bent A2 sample and the unbent The A1 sample is subjected to a withstand voltage test, and the DC voltage is set to 5000V, and the leakage current is 0.1mA. A1 group samples can withstand voltage values ​​of 5000V, 5000V, 5000V; A2 group samples can withstand voltage values ​​of 5000V, 5000V, 5000V; record and compare the actual withstand voltage values ​​of the two groups of samples. rate of 100%), the material has good bending resistance.

Embodiment 2

[0035] Cut the metal-based copper-clad laminate B to be tested into 6 samples with a width of 100 mm and a length of 100 mm, and etch the middle copper foil of the sample to be tested into a circle with a diameter of 50 mm.

[0036] Divide the samples to be tested into two groups (B1 and B2), 3 pieces in each group, bend the copper side of the B2 sample outwards and bend it 90° with a bending radius of 2 mm, and divide the bent B2 sample and the unbent The B1 sample is subjected to a withstand voltage test, and the DC voltage is set to 5000V, and the leakage current is 0.1mA. B1 group samples can withstand voltage values ​​of 5000V, 5000V, 5000V; B2 group samples can withstand voltage values ​​of 3500V, 3000V, 3000V; record and compare the actual withstand voltage values ​​of the two groups of samples, and the average retention rate of the sample withstand voltage values ​​after bending It is 63% (the retention rate is less than 80%), and the pressure resistance level of the s...

Embodiment 3

[0038] Cut the metal-based copper-clad laminate C to be tested into 6 samples with a width of 100 mm and a length of 100 mm, and etch the middle copper foil of the sample to be tested into a circle with a diameter of 50 mm.

[0039] Divide the samples to be tested into two groups (C1 and C2), with 3 pieces in each group, bend the C2 sample with the copper side outward and bend it at 90° with a bending radius of 2mm, and divide the bent C2 sample and the unbent The C1 sample is subjected to a withstand voltage test, and the DC voltage is set to 5000V, and the leakage current is 0.1mA. C1 group samples can withstand voltage values ​​of 5000V, 5000V, 5000V; C2 group samples can withstand voltage values ​​of 4500V, 4200V, 4500V; record and compare the actual withstand voltage values ​​of the two groups of samples, and the average retention rate of the sample withstand voltage values ​​after bending It is 88% (the retention rate is greater than 80%), and the pressure resistance lev...

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Abstract

A method for evaluating a mechanical property of a metal-based copper foil-coated laminated board comprises the following steps: (1) providing a to-be-tested metal-based copper foil-coated laminated board; (2) preparing to-be-tested samples: cutting the metal-based copper foil-coated laminated board into two groups of to-be-tested samples of a same size, and etching parts of copper foils of the to-be-tested samples; bending the parts of one group of the to-be-tested samples provided with copper foils, by a preset angle around a cylinder having a preset diameter, the other group of the to-be-tested samples serving as blank samples and being not bent; (4) carrying out voltage resistance testing on the two groups of to-be-tested samples; and (5) comparing voltage values capable of being borne by the two groups of to-be-tested samples, namely the to-be-tested samples and the blank samples, the samples being qualified when an average value of voltage resistance values is maintained above 80%. By means of the method, internal defects of a bent metal substrate can be recognized, the bending capability of the metal substrate can be quantitatively and effectively evaluated, and a mechanical property of the to-be-tested metal-based copper foil-coated laminated board can be simply, rapidly and conveniently evaluated.

Description

technical field [0001] The invention belongs to a method for evaluating mechanical properties, in particular to a method for evaluating the mechanical properties of a metal-based copper-clad laminate. Background technique [0002] With the mass production of electronic information products and the design trend towards light, thin, small, and multi-functional, the printed circuit substrate, which is the main support of electronic components, is also continuously improving its technical level to provide high-density wiring, thin shape, and micro-aperture. , High heat dissipation. In the background, a metal-based copper-clad laminate with high heat dissipation was born. LED is the main application field of metal-based copper-clad laminates. In order to improve the luminous effect, LEDs mounted on curved surfaces are proposed, and the bending properties of the metal-based copper-clad laminates used for them are required. [0003] The bonding and bendability of metal-based copp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/20
CPCG01N3/20
Inventor 佘乃东黄增彪吕吉张华
Owner GUANGDONG SHENGYI SCI TECH
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