Mechanical property evaluation method of metal-based copper foil-coated laminated board

Abstract

The invention provides a mechanical property evaluation method of a metal-based copper foil-coated laminated board. The mechanical property evaluation method comprises the following steps: (1) providing a to-be-tested metal-based copper foil-coated laminated board; (2) producing to-be-tested samples: cutting the metal-based copper foil-coated laminated board into two groups of to-be-tested samples with different sizes, and etching parts of copper foils of the to-be-tested samples; bending the parts, with the copper foils, of one group of the to-be-tested samples by a preset angle around a cylinder with a preset diameter, wherein the other group of the to-be-tested samples are taken as blank samples and are bent; (4) carrying out voltage resistance testing on two groups of the to-be-tested samples; and (5) comparing voltage values which can be borne by two groups of the to-be-tested samples, namely the to-be-tested samples and the blank samples, wherein the samples are qualified when the average value of voltage resistance values is maintained above 80%. By virtue of the mechanical property evaluation method, internal defects of a bent metal substrate can be differentiated, the bending capacity of the metal substrate can be quantitatively and effectively evaluated, and the mechanical properties of the to-be-tested metal-based copper foil-coated laminated board can be simply and rapidly evaluated.

Description

technical field [0001] The invention belongs to a method for evaluating mechanical properties, in particular to a method for evaluating the mechanical properties of a metal-based copper-clad laminate. Background technique [0002] With the mass production of electronic information products and the design trend towards light, thin, small, and multi-functional, the printed circuit substrate, which is the main support of electronic components, is also continuously improving its technical level to provide high-density wiring, thin shape, and micro-aperture. , High heat dissipation. In the background, a metal-based copper-clad laminate with high heat dissipation was born. LED is the main application field of metal-based copper-clad laminates. In order to improve the luminous effect, LEDs mounted on curved surfaces are proposed, and the bending properties of the metal-based copper-clad laminates used for them are required. [0003] The bonding and bendability of metal-based copp...

AI Technical Summary

Problems solved by technology

However, this test method cannot achieve accurate quantitative evaluation through observation. For example, the internal defects that appear after the bonding layer is bent cannot be judged. At the same time, it is a test sample without copper, so it is impossible to distinguish the overall bendability of the metal substrate.

Moreover, the test method is a qualitative assessment and cannot achieve quantitative assessment

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