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Electronic device

A technology for electronic devices and housings, applied in cooling/ventilation/heating transformation and other directions, can solve problems such as affecting normal operation, reducing heat dissipation efficiency of cooling modules, and affecting the temperature of electronic devices.

Inactive Publication Date: 2016-02-24
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, in addition to reducing the heat dissipation efficiency of the heat dissipation module, the heat dissipated by the heat dissipation module may turn to heat the casing and remain on the casing, continuously affecting the temperature in the electronic device, and may further affect the temperature in the electronic device. Normal operation of computing components and other components
It can be seen that the above-mentioned existing structure obviously still has inconvenience and defects, and needs to be further improved.
In order to solve the above problems, related fields have tried their best to find a solution, but no applicable method has been developed for a long time.

Method used

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Embodiment Construction

[0041] Several embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some existing conventional structures and components will be shown in a simple schematic manner in the drawings.

[0042] When a component is referred to as being "on," it can broadly mean that the component is directly on other components, or that other components exist in between. Conversely, when a component is called "directly within" another component, it cannot have other components in between. As used herein, the word "and / or" includes any combination of one or more of the associated listed items.

[0043] figure 1 I...

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Abstract

The invention provides an electronic device, comprising a housing, a fan module and a heat radiation fin group; the housing comprises an upper cover and at least one side wall; the side wall is adjacent to the upper cover and has a first opening and a second opening; the fan module is arranged in the housing; the fan module has at least one wind inlet and at least one wind outlet; the heat radiation fin group is arranged inside the housing and is positioned between the first opening and the wind outlet of the fan module; a wind inlet path is formed between the second opening and the wind inlet by the housing, the heat radiation fin group and the fan module; and wind inlet path at least passes through the space between the upper cover of the housing and the heat radiation fin group. The electronic device can reduce or can avoid the problem that the head radiation efficiency of the heat radiation module is reduced or the normal operation of the electronic device is affected because the heat radiation module is heated by the heat radiation fin group.

Description

technical field [0001] The present invention relates to an electronic device, in particular to a heat dissipation module in a portable electronic device. Background technique [0002] Generally speaking, electronic devices, such as notebook computers (Notebooks), personal computers, etc., in order to dissipate the heat generated by computing components or other components during normal operation, need to install cooling modules, such as cooling fins, fan modules, etc. This prevents heat from accumulating in the electronic device, causing the temperature inside the electronic device to rise, which affects the operation of the computing device, and in severe cases, may even damage or stop the operation of the components in the computing device. However, in order to prevent dust from directly entering the computing elements or other components in the electronic device and accumulating on them, making the heat dissipation efficiency of the computing elements or other components ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 林玮义
Owner INVENTEC PUDONG TECH CORPOARTION
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