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Ultra small and ultrathin high luminous efficiency lateral emission type high light white light polycrystalline LED element

A high-efficiency, LED chip technology, used in electrical components, electrical solid-state devices, semiconductor devices, etc., can solve the problems of insufficiency, large size, inability to miniaturize, etc., to reduce product size, improve heat dissipation, and save space. Effect

Inactive Publication Date: 2016-02-10
AMICC OPTO ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] (1) Bracket type: mainly use PPA resin + copper bracket as the substrate, the main dimensions are 020 (3.8*1.05*0.6mm), 010 (3.8*1.0*0.4mm), 215 (2.8*1.0*0.9mm), 335 (3.8*0.6*1.2mm), its size is relatively large, and the bracket-type side-firing LED cannot be made into dual-crystal / three-crystal models, and cannot meet the requirements of ultra-thin and ultra-small indicator double-color / three-color LED lights;
[0004] (2) PCB type: mainly use BT resin as the substrate, the main dimensions are 0603 (1.6*1.1*0.6mm), 0805 (2.0*1.1*0.6mm), 1204 (3.0*1.5*1.0mm), in double crystal / The general size of the three-crystal LED production is also 0805 / 1204, which cannot be miniaturized

Method used

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  • Ultra small and ultrathin high luminous efficiency lateral emission type high light white light polycrystalline LED element
  • Ultra small and ultrathin high luminous efficiency lateral emission type high light white light polycrystalline LED element
  • Ultra small and ultrathin high luminous efficiency lateral emission type high light white light polycrystalline LED element

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Embodiment 1

[0036] Preferred embodiment one: as figure 1 There are two light-emitting LED chips 2 shown, and the positive wires 4 of the two light-emitting LED chips 2 are welded to the positive region 71 in the middle, and the two negative wires 5 are respectively connected to two mutually independent negative regions 72 on both sides. welding. The ultra-small, ultra-thin, high-efficiency side-firing high-brightness white light twin-crystal LED element is rectangular: its length is 1.6±0.2mm, its width is 0.6±0.2mm, and its thickness d is 0.3±0.1mm. Preferably: length 1.6mm, width 0.6mm, thickness 0.3mm.

Embodiment 2

[0037] Preferred embodiment two: as figure 2 , 3 There are three light-emitting LED chips 2 shown, and the positive wires 4 of the three light-emitting LED chips 2 are all welded to the positive region 71 in the middle, and the three negative wires 5 are respectively welded to three mutually independent negative regions 72 on both sides. . The ultra-small, ultra-thin, high-efficiency side-firing high-brightness white three-crystal LED element is rectangular: its length is 1.6±0.2mm, its width is 0.6±0.2mm, and its thickness d is 0.4±0.1mm. Preferably: length 1.6mm, width 0.6mm, thickness 0.4mm.

[0038] A process for preparing an ultra-small, ultra-thin, high-efficiency side-firing high-brightness white polycrystalline LED element, the steps are as follows:

[0039] a. Prepare raw materials: Drill through holes on the PCB substrate 1 and conduct the upper and lower bottom surfaces of the PCB substrate 1 through the copper plugging process to form the plug hole copper pilla...

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Abstract

The present invention relates to an ultra small and ultrathin high luminous efficiency lateral emission type high light white light polycrystalline LED element comprising a substrate and at least two luminous LED chips, wherein the luminous LED chips are fixed on the pedestal, the pedestal is provided with a number of conduction holes that penetrate the upper surface and the lower surface of the pedestal, the conduction holes are filled with electric conduction bodies, the positive electrodes of all the luminous LED chips are respectively and electrically connected with an electric conduction body in at least one conduction hole through positive electrode conduction wires, and the negative electrodes of all the luminous LED chips are respectively and electrically connected with electric conduction bodies in remaining conduction holes through negative electrode conduction wires. The present invention provides the ultra small and ultrathin high luminous efficiency lateral emission type high light white light polycrystalline LED element which is extremely small in thickness and good in heat dissipation effect.

Description

technical field [0001] The invention relates to an ultra-small, ultra-thin, high-light-efficiency side-emitting high-brightness white light polycrystalline LED element, in particular to a small side-emitting polycrystalline LED element. Background technique [0002] At present, there are two types of small side-emitting LED indicators on the market: [0003] (1) Bracket type: mainly use PPA resin + copper bracket as the substrate, the main dimensions are 020 (3.8*1.05*0.6mm), 010 (3.8*1.0*0.4mm), 215 (2.8*1.0*0.9mm), 335 (3.8*0.6*1.2mm), its size is relatively large, and the bracket-type side-firing LED cannot be made into dual-crystal / three-crystal models, and cannot meet the requirements of ultra-thin and ultra-small indicator double-color / three-color LED lights; [0004] (2) PCB type: mainly use BT resin as the substrate, the main dimensions are 0603 (1.6*1.1*0.6mm), 0805 (2.0*1.1*0.6mm), 1204 (3.0*1.5*1.0mm), in double crystal / The general size of the three-crystal LE...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/62H01L33/64
CPCH01L2224/48091H01L2224/48227H01L2224/48237H01L2924/181H01L2924/00014H01L2924/00012
Inventor 蔡志嘉窦鑫
Owner AMICC OPTO ELECTRONICS TECH
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