Three-dimension symmetrical vertical transformer

Abstract

First and second paths of the primary-coil of the transformer are located at different sides of the symmetry-line. First terminals of the first and second paths are first and second ports of the primary-coil. Second terminals of the first and second paths are connected to each other. Two partial paths of the first path are connected to each other by TSV. Two partial paths of the second path are connected to each other by TSV. Third and fourth paths of the secondary-coil of the transformer are located on different sides of the symmetry-line. First terminals of the third and fourth paths are first and second ports of the secondary-coil. Second terminals of the third and fourth paths are connected to each other. Two partial paths of the third path are connected to each other by TSV. Two partial paths of the fourth path are connected to each other by TSV.

Description

technical field [0001] The present invention relates to a transformer, and in particular to a three-dimensional symmetrical vertical transformer. Background technique [0002] The integrated circuit technology can implement various passive components (Integrated passive device, IPD) in the chip by using the front-end technology. The inductor and transformer in the chip are common passive components, and have been widely used in various radio frequency integrated circuits, such as low noise amplifier (low noise amplifier, LNA), voltage-controlled oscillator (voltage-controlled oscillator, VCO), injection-locked Frequency divider (injection-lockedfrequencydivider, ILFD), and power amplifier (poweramplifier, PA), etc. Although implementing inductors and transformers on-chip can reduce the number of external components, the passive components in these chips often occupy a large amount of chip area, resulting in increased cost in expensive front-end processes. [0003] The deve...

AI Technical Summary

Problems solved by technology

However, when packaging requirements become more complex, SiP technology also encounters design bottlenecks such as operating speed, power consumption, and size.

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