Grinding device

A technology for grinding and processing objects, used in grinding/polishing equipment, parts of grinding machine tools, metal processing equipment, etc.

Active Publication Date: 2019-03-15
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] When grinding a plurality of wafers at the same time, if grinding is performed while bringing the contact of the thickness gauge into contact with the front surface of the workpiece as described above, the contact will be caught between the rotating small-diameter workpiece , there is a problem that the height from the holding surface of the workpiece cannot be measured stably

Method used

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Embodiment Construction

[0017] Hereinafter, modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to what is described in the following embodiments. In addition, the constituent elements described below include those easily conceivable by those skilled in the art and those substantially the same. Furthermore, the configurations described below may be appropriately combined. In addition, various omissions, substitutions, or changes in the structure can be made without departing from the gist of the present invention.

[0018] according to Figure 1 to Figure 5 A grinding device according to an embodiment of the present invention will be described. figure 1 It is an external perspective view showing the structure of the grinding device of the embodiment, figure 2 It is a perspective view of the holding unit, the height measuring device, etc. of the grinding device of the embodiment, image 3 It i...

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Abstract

The present invention provides a grinding device which is able to make a measurement probe steadily touch the upper surface of a processed object and measure the thickness of the processed object in the condition of grinding a plurality of measured objects at the same time. The grinding device comprises a maintenance unit with a maintenance configured to maintain the processed object (W); a grinding unit configured to grind the back (WR), used for maintenance, of the processed object (W); and a height finder (40) configured to measure the height of the back (WR) of the processed object (W) grinded by the grinding unit. The height finder (40) has two measurement probes (43) arranged at the positions having the same height at the contact points on the back (WR) of the processed object (W). The two measurement probes (43) are arranged on the circle (C) taking a rotation axis (A) as a center along the maintenance unit, and are separately arranged in an interval (W1) of larger than an adjacent processed object (W) at the circumference.

Description

technical field [0001] The present invention relates to a grinding device for grinding a workpiece while measuring the height of the upper surface of the workpiece. Background technique [0002] When grinding various workpieces thinly and finishing them to a desired thickness, the grinding is performed while measuring the thickness of the workpieces, and the grinding is terminated when the thickness reaches the desired thickness. As a method of measuring the thickness of a workpiece, there is known a contact measurement method in which a contact piece of a thickness measuring device is brought into contact with the surface holding the workpiece and the surface of the table holding the workpiece, and the difference in height between them is obtained. , and calculate the thickness of the workpiece from the difference (for example, refer to Patent Document 1). [0003] On the other hand, as wafers as workpieces formed of sapphire, gallium nitride (GaN), etc., some wafers have ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B49/04
CPCB24B49/04
Inventor 三原拓也
Owner DISCO CORP
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