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Boring method of metal substrate and detection method of hole diameter

A technology of metal substrate and drilling method, which is applied in the field of circuit board manufacturing, can solve the problems of inability to verify missing or wrong drilling, and inconvenient measurement of hole diameter, so as to optimize the method of measuring hole diameter, reduce human resources and production time, and test the effect Good results

Inactive Publication Date: 2016-01-20
KINWONG ELECTRONICS TECH LONGCHUAN
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Problems solved by technology

[0002] Metal substrate products need to drill holes in many places on the board during the PCB production process. The number of holes on a board is about 200 or more. There are too many holes on the board surface. It is inconvenient to measure the hole diameter after drilling, and it is impossible to verify whether there are missing drills during the production or mis-drilling phenomenon

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  • Boring method of metal substrate and detection method of hole diameter

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Embodiment Construction

[0019] The present invention will be further described below in conjunction with the drawings and specific embodiments:

[0020] The metal substrate drilling method of the present invention mainly includes the following steps:

[0021] (1) Combine the metal substrate single boards to form a large board;

[0022] (2) According to the size of the aperture, drill a working hole 2 of one aperture in the effective unit 1 of the jigsaw, and then drill a detection hole 4 of the same aperture in the process edge 3. For example, such as figure 1 As shown, there are a total of four kinds of holes to be drilled. According to the order of hole diameter from large to small or from small to large, first drill the working hole 2 of the first type in the effective unit 1, and then drill the first type of hole in the process side 3. Detect hole 4, then use the same method to drill the second type of aperture 2 and test hole 4 successively, the remaining aperture is also the same operation, and fina...

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Abstract

The invention relates to the field of manufacturing a circuit board, particularly to a boring method of a metal substrate and a detection method of the hole diameter. The boring method of the metal substrate comprises the following steps: (1) splicing metal substrates; and (2) boring working holes with hole diameters in an effective unit of the spliced substrate in sequence according to the size of the hole diameter, and boring detection holes, the diameter of which are same as that of the working holes, in an technical edge. The detection method of the hole diameter comprises the following steps: (1) listing a ranked list of the hole size according to boring order; and (2) detecting the hole size of the detection holes in the bottom board of the metal substrate in sequence according to the ranked list of the hole size. During a process of boring the working hole, the detection hole is bored at the same time, and the detection method of the hole diameter is optimized. The detection efficiency is improved, and the human resources and production time are reduced. The methods are simple and fast to operate, low in cost, and good in detection effect, and can meet requirements of quality and production.

Description

Technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for drilling a metal substrate and a method for detecting its aperture. Background technique [0002] Metal substrate products need to be drilled in many places during the PCB production process. The number of holes in a board is about 200 holes or more. There are too many holes in the board. It is inconvenient to measure the hole diameter after drilling, and it is impossible to verify whether there is a hole in the production process. Or the phenomenon of wrong drilling. Summary of the invention [0003] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a metal substrate drilling method that is convenient for detecting the hole diameter and the hole diameter detecting method. [0004] In order to achieve the above objectives, the present invention can be achieved through the following technical solutions: [0005] A metho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0047H05K2203/163
Inventor 邓伟良
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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